In this work, the fabrication and the reliability of 100 /spl mu/m pitch compliant off-chip G-helix interconnects are presented. A three-mask process was used to successfully fabricate the free-standing compliant interconnect at a pitch of 100 /spl mu/m. The geometry of the interconnect was optimized for mechanical and electrical performance. Also, a thermo-mechanical reliability simulation was performed. It was seen from the simulations that the G-helix interconnect assembly on an organic substrate, without the use of an underfill, could last more than 1000 thermal cycles.