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Landshut Silicon Foundry , adixen , TPI , GLOBALFOUNDRIES Dresden Module One LLC & Co. KG , RMT , FHWN , MEMC , SUSS MICROOPTICS , SunEdison (United States) , ICN2 , Protec Carrier Systems GmbH , NANDA TECHNOLOGIES GMBH , Oxford Instruments (Germany) , RF SUNY , Ams AG , SUSS MicroTec (Germany) , SUSS MicroTec Lithography GmbH , JO AT , Metryx , SOITEC , ...
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Landshut Silicon Foundry , adixen , TPI , GLOBALFOUNDRIES Dresden Module One LLC & Co. KG , RMT , FHWN , MEMC , SUSS MICROOPTICS , SunEdison (United States) , ICN2 , Protec Carrier Systems GmbH , NANDA TECHNOLOGIES GMBH , Oxford Instruments (Germany) , RF SUNY , Ams AG , SUSS MicroTec (Germany) , SUSS MicroTec Lithography GmbH , JO AT , Metryx , SOITEC , ICT Integrated Circuit Testing GmbH , Infineon Technologies (Germany) , SUSS MicroTec Photomask Equipment , LAM RESEARCH AG , KLA , ACP , Mapper Lithography (Netherlands) , IMEC , FHG , AMIL , STM CROLLES , MIY , Oxford Instruments (United Kingdom) , SILTRONIC AG , Ibs (France) , SEMILAB ZRT , CEA , Intel (United States) , PVA-AS , HQ-Dielectrics (Germany) , FRT GmbH
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