The project aims at developing new, low-cost and innovative technologies devoted to the design of 2D, 2,5D and 3D radiofrequency (RF) components and interconnection systems printed on conformable materials (structured paper, plastic films). The scientific challenge is the following one: the design for the first time of RF functions STICKERS integrated in future electronic devices, affixed for instance on any sidewall of their housing. The targeted applications are primary the home-networking devices such as set-top boxes. Its ambition is also that the outstanding results can be exploited for other applications for which RF components integration and cost are key parameters. The central approach of the project is to take benefit from the compelling growth and evolution of printed and flexible electronics technologies which mostly address applications such as sensor, display and RFID to investigate other application fields such as wireless communication systems, with more particularly the design of ultra low cost RF front-end passive components including mainly antenna, filter and interconnections. In just a few years, the eco-system of set-top-boxes (STB) and gateways (GW) have drastically evolved with the pushing demand of new services and new connectivity, becoming a Smart-Home device. Most of them lead to the integration of many wireless systems including, for instance, ZigBee/Zwave wireless home automation service, high speed Wireless LAN (WLAN) connectivity, DECT cordless phone system, Bluetooth low-rate and short range connectivity, radio-based RF4CE remote control, and in the near future, WWAN (Wireless Wide Area Network) connectivity using the high data rate service offered by 3G and 4G (LTE) networks ; another essential connectivity will be Near Field Communication (NFC) for identification, peering and payment applications. 60GHz wireless system, through the emerging IEEE.802.11ad standard, will be also a must have technology since it offers ultra fast multi-Gbps cable-free connectivity. As can be seen, the multi-connectivity is a key issue for consumer device manufacturers in the 2020 horizon, and the proposed integration technology of the STICK’IT project will undoubtedly contribute to pave the road towards future emerging and highly competitive markets of the wireless industry To carry out this project, the consortium is constituted of Experts in the distinct research domains: development of new materials and characterization, design of cutting-edge technologies based RF and microwave components, design of wireless systems, design and fabrication in high volume of home multimedia Customer Premises Equipments. In this way, all the competences, realization and test facilities are available and complementary to contribute significantly to the research in this domain and to cross-over the various technical and technological barriers of which the STICT’IT project will strive to.