DANFOSS POWER ELECTRONICS AS
DANFOSS POWER ELECTRONICS AS
6 Projects, page 1 of 2
assignment_turned_in Project2010 - 2013Partners:ISL, PSA, Fortiss, Infineon Technologies (Germany), DELPHI DE +37 partnersISL,PSA,Fortiss,Infineon Technologies (Germany),DELPHI DE,ELEKTROBIT AUTOMOTIVE GMBH,DTU,SSF,Infineon Technologies (United Kingdom),DELPHI,VALMET,VALIDAS AG,SAFERIVER,EADS DEUTSCHLAND GMBH,TÜV SÜD,TRTUK,SDU,TECNALIA,INTEGRASYS,SYSGO,THALES,PAJ Systemteknik,AAU,WA&S,SYM,Åbo Akademi University,Technische Universität Braunschweig,CEA,KONE,DANFOSS POWER ELECTRONICS AS,SKOV AS GLYNGORE,AALTO,Polytechnic Institute of Porto,SPINET,UGR,SYSGO AG,HONEYWELL INTERNATIONAL SRO,CAMEA,VUT,SEVEN SOLUTIONS SL,ESPELSA,ISEPFunder: European Commission Project Code: 100202more_vert Open Access Mandate for Publications assignment_turned_in Project2012 - 2015Partners:DANFOSS POWER ELECTRONICS AS, AIT, ENEL INGEGNERIA E RICERCA SPA, Alitec SRL, IMEC +4 partnersDANFOSS POWER ELECTRONICS AS,AIT,ENEL INGEGNERIA E RICERCA SPA,Alitec SRL,IMEC,KUL,3E,SUPSI,Carl von Ossietzky University of OldenburgFunder: European Commission Project Code: 308991more_vert assignment_turned_in Project2014 - 2017Partners:HI Iberia (Spain), SYSTEMATIC, OFFIS EV, VOLVO TECHNOLOGY AB, TNO +101 partnersHI Iberia (Spain),SYSTEMATIC,OFFIS EV,VOLVO TECHNOLOGY AB,TNO,Critical Software (Portugal),THALES ALENIA SPACE FRANCE,PHILIPS MEDICAL SYSTEMS NEDERLAND,VISURE,VIF,AIT,CEA,TELE ATLAS,RTU,Magillem Design Services,Infineon Technologies (Austria),Chalmers University of Technology,INRIA,IMEC-NL,KTH,ABB AB,Infineon Technologies (United Kingdom),SICS,Thalgo (France),EADS DEUTSCHLAND GMBH,Harokopio University,ALTEN SVERIGE AKTIEBOLAG,POLITO,WESTERNGECO AS,CINI ,Technische Universität Braunschweig,DANFOSS POWER ELECTRONICS AS,RCF,Siemens (Germany),Polytechnic Institute of Porto,CRF,TOMTOM,UL,University of Kaiserslautern,ISEP,ALTEN SVERIGE AKTIEBOLAG,IMA,AMBAR TELECOMUNICACIONES S.L.,DTU,TECNALIA,NXP (Germany),eVision Systems GmbH,AICAS,Systonomy,TU Dortmund University,TUW,TAS-E,Luleå University of Technology,FINMECCANICA,AVL,ELEKTROBIT AUTOMOTIVE GMBH,INESC ID,BMW (Germany),Alenia Aermacchi,NXP (Netherlands),Fornebu Consulting (Norway),SEVEN SOLUTIONS SL,TU/e,University of Manchester,AVL SOFTWARE AND FUNCTIONS GMBH,IXION INDUSTRY AND AEROSPACE SL,SES SPA,INTEGRASYS,SYSGO,EAB,MBDA ITALIA SPA,SYSTEMITE AB,Goa University,Arccore (Sweden),THALES,FREQUENTIS,ENSILICA LIMITED LTD,FHG,Vector Fabrics (Netherlands),SYSGO AG,Simula Research Laboratory,Arcticus Systems (Sweden),DNDE,Thales (Austria),AVCR,TU Delft,Infineon Technologies (Germany),Schneider Electric (France),SUNDANCE MULTIPROCESSOR TECHNOLOGY LTD,QUOBIS,University of Bristol,UTIA,TECHNOLUTION B.V.,UiO,ITI,University of L'Aquila,TVS,SILKAN RT,TASITALIA,BMW Group (Germany),NXP SEMICONDUCTORS CZECH REPUBLIC SRO,TTTech Computertechnik (Austria),VUT,UTRC,Schneider Electric (Spain),BLUEICE BVBAFunder: European Commission Project Code: 621429more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2025 - 2028Partners:PT PORTUGAL TELECOM MEO, CEA, UEF, WEEBIT NANO, SORAMA +61 partnersPT PORTUGAL TELECOM MEO,CEA,UEF,WEEBIT NANO,SORAMA,GEOSYSTEMS HELLAS IT KAI EFARMOGESGEOPLIROFORIAKON SYSTIMATON ANONIMIETAIREIA,INNATERA NANOSYSTEMS BV,LOCSENSE B.V.,THALES DIS FRANCE SAS,ALMENDE,UNITY-SC,FRAUNHOFER,Technische Universität Braunschweig,ThingLink,Pfeiffer Vacuum (Germany),ST,IRNOVA,Grenoble INP - UGA,EMMTRIX,UPRC,UoA,SOITEC,AVCR,APPLIED MATERIALS ITALIA SRL,FOI,DTU,TECHNEXT,STGNB 2 SAS,University of Twente,MICRO-SENSYS GMBH,XGS,IFEVS,MARULLO SPA,ENDIIO ENGINEERING GMBH,IT,KNOWTION GMBH,UNIPV,IUNET,KOVILTA OY,GN STORE NORD,Aristotle University of Thessaloniki,KTH,RICCA IT,STRIKERSOFT,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,IMEC-NL,X-FAB Dresden,Pfeiffer Vacuum (France),FHG,UGA,TU Darmstadt,DANFOSS POWER ELECTRONICS AS,STM CROLLES,IMA,TÜBİTAK,IMMS GMBH,University of Seville,HALTIAN,ISD,STMicroelectronics (Switzerland),PICOSUN OY,UAB,UGA,UTIA,AMU,TU DelftFunder: European Commission Project Code: 101194172Overall Budget: 95,629,000 EURFunder Contribution: 25,010,700 EUREurope is poised to play a pivotal role in the technological revolution, particularly in the field of edge AI, which promises sustainable growth, performance, and reliability. The NeAIxt project is a strategic initiative designed to foster European independence and control over edge AI technology, benefiting both companies and citizens. The project presents a golden opportunity for European SMEs to grow, network, and enhance skills, leveraging exposure to the global market. Research labs and RTOs will bridge the gap to the future by developing necessary technologies and competencies, while universities will cultivate and disseminate advanced skills required for this technological evolution. NeAIxt aims to solidify Europe's position in edge AI and eNVM technology by enhancing AI enablers, evolving eNVM for edge applications, and demonstrating AI capabilities at both chip and system levels. The project is committed to ensuring the safety and security of AI services, adhering to EU regulations. Key technical developments include the advancement of 18nm FD-SOI and next-generation embedded Phase Change Memory (ePCM). These innovations will lead to high-performance, secure microcontrollers with AI capabilities, offering low power consumption and high security for smart applications. The project will integrate advances in non-volatile memory technologies with cutting-edge MCU design to enable efficient in-memory computing. This synergy will deliver a fully European solution for reliable, safe, and independent edge AI applications. NeAIxt will address the entire edge AI value chain, from academia to industry, and from design to end-user applications, building on Europe's strong technological foundation. The project's outcomes will alleviate societal concerns about AI proliferation by ensuring compliance with European privacy standards, fostering AI adoption in various sectors.
more_vert Open Access Mandate for Publications assignment_turned_in Project2021 - 2024Partners:PDM&FC, SENSATIVE AB, ANYWI, VESTEL ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI, UGR +45 partnersPDM&FC,SENSATIVE AB,ANYWI,VESTEL ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI,UGR,SIRRIS,G&D,JSI,ESC AEROSPACE GMBH,BEYOND VISION - SISTEMAS MOVEIS AUTONOMOS DE REALIDADE AUMENTADA LDA,GRADIANT,XAL,mediri GmbH,RISE,VUT,COSYLAB,FHG,SESTEK SES VE ILETISIM BILGISAYAR TEKNOLOJILERI SANAYI TICARET ANONIMSIRKETI,TST,Tieto,INNATERA NANOSYSTEMS BV,IT,KOALA TECH LDA,SEVEN SOLUTIONS SL,STEP SOLUTIONS AS,University of Siegen,Jotne,EVENTIGRATE,NXP (Germany),ALMENDE,University of Lübeck,AKIM METAL SANAYI VETICARET AS,IMEC-NL,IMA,OCTAVIC PTS APS,UC,DTU,TPV AUTOMOTIVE d.o.o.,DANFOSS POWER ELECTRONICS AS,GS,NXP (Netherlands),TU/e,Arctos Labs Scandinavia AB,ITI,Schneider Electric (France),Technical University of Liberec,[no title available],MDH,TU Delft,Schneider Electric (Spain)Funder: European Commission Project Code: 101007273Overall Budget: 32,726,200 EURFunder Contribution: 9,811,060 EURThe use of artificial intelligence (AI) in Edge computing is entering a new era based on the use of ubiquitous small and connected devices. Until now, Europe has not been doing well, as America sets the standards and most components are produced in Asia or America. This project believes doing better is realized by (1) Putting European values of self-organization, privacy by design and low use of energy in the core of the Edge Computing components that shape this new era, and delivering the technology needed to promote these values; (2) Focusing on pan European cooperation to ramp up the capabilities needed to deliver these new components at a scale that can make a real impact. Europe does not have huge IT leaders so cooperation from a very early phase is key. All partners in the project participate in delivering key parts of these new Edge Computing components; and (3) Demonstrating the use of these components in key European industrial areas. Clear and early examples are needed to un-lock corporate and external funding to deliver on the promise of this very exciting project. The DAIS project will research and deliver distributed artificial intelligent systems. It will not research new algorithms, as such, but solves the problems of running existing algorithms on these vastly distributed edge devices that are designed based on the above three European core values. The research and innovation activities are organized around eight complementary and mutually supportive supply chains. Five of these focus on delivering the hardware and software that is needed to run industrial-grade AI on different types of networking topologies. Three of the supply chains demonstrate how known AI challenges, from different functional areas, are met by this pan European effort. The DAIS project consists of 48 parties from 11 different countries. The DAIS project fosters cooperation between large and leading industrial players from different domains.
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