The AHRC funded Laser Enhanced Biotechnology for Textile Design (LEBIOTEX, Grant Ref: AH/J002666/1, 30 June 2012 to 29 June 2015) project resulted in the realisation of a method for dyeing and patterning textile surfaces in one step using CO2 laser technology. This technique is termed 'peri-dyeing' and involves applying dye locally to the surface of a textile substrate followed by laser irradiation. The dye diffusion and reaction takes place at the point of laser interaction. The novel technique offers digital design opportunities allowing multi-tonal, multi-colour, photographic and precise linear details with high levels of customisation on both natural and synthetic fibre fabrics (e.g. wool, polyester, nylon). Customised colouration on both fabric and assembled garments, including across seams, enables remote, on-demand, non-contact processing of finished products and offers the potential for fixation of chemicals other than dye (e.g. fire retardants, anti-bacterial) to achieve localised surface modification and functionality. The technique has the potential to make significant savings in energy, water and dye use in comparison with conventional textile colouration and patterning processes. The peri-dyeing process suggests alternative manufacturing and distribution flows that may allow for a more precise, responsive approach to market demands potentially reducing waste stock and enabling a more efficient distribution of goods. The aim of the proposed follow-on project is to identify and pursue new opportunities to implement and exploit the peri-dyeing technique within different textile sectors, focusing on the potential to apply peri-dyeing directly to garments, fashion and upholstery fabrics. This will enable localised and on-demand surface colouration, three-dimensional patterning and surface modification for both aesthetic appearance and functionality, alongside environmental and cost benefits. The emphasis on working directly with textile industry partners in four different sectors will significantly enhance the impact of the recent LEBIOTEX research.

This proposal is concerned with the research and development of new manufacturing methods that add electronic functionality to the heart of textiles by incorporating semiconductor devices into yarns. Textiles are one of the most common materials with which humans come into contact, but, at present, their functionality is limited to their appearance and physical properties. There is considerable and growing interest in multifunctional textiles with added electronic functionality: These will offer a far greater range of functionality that can include sensing, data processing and interaction with the user and, as a result, can be applied in a vast range of applications. Electronic textiles (E-textiles) need to not only perform well but also be robust, comfortable to wear and be readily used, worn, washed, and maintained. Currently, electronics have been integrated with textiles by either attaching or printing the electronics onto the surface of a textile (first generation), or the electronic functionality is added at the textile manufacturing stage (second generation). The first generation E-textiles will always interfere with the textile properties of a garment; even thin film devices or circuits printed on textiles. As a textile conforms to a shape some regions bend and some go into shear deformation: Both factors are important for drape and conformability. Knitted and woven textiles are able to conform to a shape as they bend and shear however, a thin polymer film can bend but, as it cannot shear, it will buckle and crumple rather than conform to a shape. The second generation textiles may retain a textile feel but are limited in their applications, such as the creation of electrical pathways, and electrode-based sensing. Therefore, Professor Dias (the PI) pioneered the development of a platform technology for embedding semiconductor packaged dice within the core of yarns, in order to integrate electronics into the heart of textile structures. The production process starts with re-flow soldering of package dice onto fine copper wire. A carrier yarn is placed in parallel to provide improved tensile strength to the copper wire populated with packaged dice. The package dice and carrier yarn are then encapsulated within polymer micro-pods to provide protection from moisture ingress. The micro-pod and copper interconnects are finally surrounded with additional fibres held tightly together within a knitted fibre sheath to create an electronic yarn (E-yarn). The aim of this project is to create the underlying knowledge to produce E-yarns in an automated fashion reliably, and to demonstrate an automated pilot manufacturing line (TRL4). The ability to produce E-yarns in a semi-automated fashion using two-terminal packaged dice has already been demonstrated by the investigators. The programme of research will extend this expertise to the reliable creation of E-yarns based on semiconductor devices with more than two terminals, massively extending the scope for the types of E-yarn that can be created. To achieve this ambitious goal the following research areas must be addressed: thermal energy management for soldering semiconductor dice; encapsulation of soldered dice; optimisation of the techniques of covering copper wires populated with dice to prevent their migration to the surface of the E-yarn; development of testing methods for the E-yarns. This proposal concerns a platform manufacturing technology that can address a range of E-textiles applications. The research will ensure that the technology can deliver the required functionality, meet the requirements of practical use, and provide the platform for commercialising the E-yarn technology. Project results will increase industry capability in the UK to lead the E-textile sector, which is expected to grow to a $5 billion market by 2028; hence the proposed research is timely. [1] www.idtechex.com/research/reports/e-textiles-2018-2028-technologies-markets-and-players-000613.asp

The UK's textiles and clothing industry makes a significant contribution to the economy employing over 130,000 individuals and is experiencing resurgence with production rising by 2.5% over the last two years to a value of £9.1 billion. E-textiles are an emerging and enabling technology with broad potential applications in many areas such as clothing, home furnishing, workwear, sports, medical, architecture and automotive. The e-textiles market is forecast to grow from $100 million to $5 billion by 2027. E-textiles can also be used in many other emerging areas such as wearable technologies and IoT. This proposal is to create an E-textiles Network community to bring academia, industry and end users together to identify research challenges and catalyst the collaboration to address these challenges. The e-textiles network will ensure widely dissemination and knowledge exchanges using variety of mechanisms. In particular, the annual two-day conference will bring the community together to disseminate the research findings and engage with industry and end users. While network will be co-ordinated by the University of Southampton, the priorities and activities will be driven by a steering board with balanced representation from a range of other universities, companies, end users and policy makers. The success of the proposed network will ensure the UK keeps its leading role in the innovation and manufacturing of e-textiles.

This proposal is concerned with the research and development of new manufacturing and assembly methods that add electronics functionality to textiles. Textiles are ubiquitous and are used, for example, in clothing, home furnishings as well as medical, automotive and aerospace applications. Textiles are one of the most common materials with which humans come into contact, but, at present, their functionality is limited to their appearance and physical properties. There is considerable and growing interest in SMart and Interactive Textiles (SMIT) that add electronic functionality to textiles. SMIT offer a far greater range of functionality that can include sensing, data processing and interaction with the user and, as a result, can be applied in a vast range of applications potentially wherever textiles are present. The overall objective of the research is to develop new manufacturing assembly methods that enable the reliable packaging of advanced electronic components (e.g. microcontrollers) in ultra-thin die form within a textile yarn. The programme of research will investigate approaches for mounting the ultra-thin die onto thin flexible polymer films strips that contain patterned conductive interconnects and bond pads. Individual die will be located on the strip and conductive tracks on the plastic substrate will them together forming a long, very thin, flexible circuit or filament. The filaments will then be surrounded by classical textile fibres (e.g. polyester, cotton, wool, silk) and connected to conductive wires to form an electronic yarn (EY) that will, essentially, appear to be a standard textile yarn but which has embedded within it, circuitry and components. The ultimate goal is to incorporate these EYs into the textile in such a way as to protect the electronic components and interconnects from the rigours of use whilst maintaining the feel, drape and breathability of the textile. A key aspect of the technology is the use of ultra-thin die which are highly flexible and, together with a rectangular footprint, will minimise the profile of the die within the filament. This will then serve to reduce the impact on the yarn making the electronics virtually invisible and minimising yarn diameter.