Printed Electronics Ltd
Printed Electronics Ltd
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18 Projects, page 1 of 4
assignment_turned_in Project2012 - 2017Partners:Delcam International plc, Aptiv (Ireland), BAE Systems (Sweden), Boeing Co, Renishaw plc (UK) +31 partnersDelcam International plc,Aptiv (Ireland),BAE Systems (Sweden),Boeing Co,Renishaw plc (UK),3T RPD Ltd,Objet Geometries Ltd,3T Additive Manufacturing Ltd,The Welding Institute,AWE plc,National Physics Laboratory NPL,Objet Geometries Ltd,Solidica Corp,University of Nottingham,EOS,Printed Electronics Limited,Printed Electronics Ltd,Delcam International plc,Delphi Diesel Systems Ltd,Smart Fibres Ltd,Econolyst Ltd,Solidica Corp,NTU,RENISHAW,MTT TECHNOLOGIES LIMITED,BAE Systems (United Kingdom),MTT TECHNOLOGIES LIMITED,TWI Ltd,Smart Fibres,Econolyst Ltd,Aptiv (United Kingdom),Boeing Co,AWE,EOS GmbH - Electro Optical Systems,NPL,BAE SystemsFunder: UK Research and Innovation Project Code: EP/I033335/2Funder Contribution: 5,618,010 GBPThe EPSRC Centre for Innovative Manufacturing in Additive Manufacturing will create a sustainable and multidisciplinary body of expertise that will act as a UK and international focus - the 'go to' place for additive manufacturing and its applications. The Centre will undertake a user-defined and user-driven programme of innovative research that underpins Additive Manufacturing as a sustainable and value-adding manufacturing process across multiple industry sectors.Additive Manufacturing (AM) is the direct production of end-use component parts made using additive layer manufacturing technologies. It enables the manufacture of geometrically complex, low to medium volume production components in a range of materials, with little, if any, fixed tooling or manual intervention beyond the initial product design. AM enables a number of value chain configurations, such as personalised component part manufacture but also economic low volume production within high cost base economies. This innovative approach to manufacturing is now being embraced globally across industry sectors from high value aerospace / automotive manufacture to the creative and digital industries. To date AM research has almost exclusively focused upon the production of single material, homogeneous structures (in polymers, metals and ceramics). The EPSRC Centre for Innovative Manufacturing in Additive Manufacturing will move away from single material, 'passive' AM processes and applications that exhibit conventional levels of functionality, toward the challenges of investigating next generation, multi-material active additive manufacturing processes, materials and design systems. This transformative approach is required for the production of the new generation of high-value, multi-functional products demanded by industry. The Centre will initially explore two themes as the centrepieces of a wider research portfolio, supported by a range of platform activities. The first theme takes on the challenge of how to design, integrate and effectively implement multi-material, multi-functional manufacturing systems capable of matching the requirements of industrial end-users for 'ready-assembled' multifunctional devices and structures. Working at the macro level, this will involve the convergence of several approaches to increase embedded value to the product during the manufacturing stage by the direct printing / deposition of electronic / optical tracks potentially on a voxel by voxel basis; the processing and bonding of dissimilar materials that ordinarily require processing at varying temperatures and conditions will be particularly challenging. The second theme will explore the potential for 'scaling down' AM for small, complex components, extending single material AM to the printing of optical / electronic pathways within micro-level products and with a vision to directly print electronics integrally. The platform activities will provide the opportunity to undertake both fundamental and industry driven pilot studies that both feed into and derive from the theme-based research, and grow the capacity and capability of the Centre, creating a truly national UK Centre and Network that maintains the UK at the front of international research and industrial exploitation in Additive Manufacturing.
more_vert assignment_turned_in Project2016 - 2019Partners:Printed Electronics Ltd, PRINTED ELECTRONICS LIMITEDPrinted Electronics Ltd,PRINTED ELECTRONICS LIMITEDFunder: UK Research and Innovation Project Code: 620126Funder Contribution: 52,060 GBPAwaiting Public Project Summary
more_vert assignment_turned_in Project2017 - 2022Partners:Smith and Nephew Healthcare Ltd, Printed Electronics Ltd, University of Birmingham, University of Birmingham, Smith and Nephew Healthcare Ltd +5 partnersSmith and Nephew Healthcare Ltd,Printed Electronics Ltd,University of Birmingham,University of Birmingham,Smith and Nephew Healthcare Ltd,NIHR WoundTec Healthcare Technology Coop,SEN,Printed Electronics Limited,Sensapharm Limited,NIHR WoundTec Healthcare Technology CoopFunder: UK Research and Innovation Project Code: EP/N02074X/2Funder Contribution: 778,431 GBPChronic wounds are those that fail to heal in an orderly and timely (typically three months) manner. Examples of chronic wounds include diabetic foot ulcers, pressure ulcers and venous leg ulcers. The incidence of chronic wounds is increasing as a result of lifestyle changes and the ageing population. For example, ~552 million people worldwide are estimated to have diabetes mellitus in 2030. Up to an estimated 25% of these patients will develop diabetic foot ulcers in their lifetime; half of these ulcers will be infected and 20% will undergo amputation of their lower limb. The annual economic impact of chronic wounds, which includes nursing time and dressing materials, on the global economy is estimated to be ~£20 billion by 2030. A common practise in wound management is to cover wounds with suitable dressings to facilitate the healing process. Standard dressings, however, do not provide insights into the status of the wound underneath. Thus, dressings are often changed to examine and assess the wound. This in turn hampers the process of normal wound healing and cause stress and pain to patients. The assessment process also consumes a significant amount of nursing time and dressing materials, which contributes to spiralling medical costs in wound care. In addition, current treatment methods do not use physical or chemical feedback to modify or adjust the treatment based on wound's condition, and hence have limited success. It has been proposed to embed sensors in dressings to enable clinicians and nurses to make effective diagnostic and therapeutic wound management decisions without changing wound dressings; therefore improving patient comfort. Existing sensors, however, do not satisfy the operational (e.g. sensitivity, specificity) and physical (e.g. flexibility) characteristics required for embedding them in dressings. This project will develop a sensor system to overcome these limitations. The proposed sensor system will consist of a small laser that will emit light of different colour based on the concentration of a biomarker of interest in the fluid interface at the wound surface. The change in the colour of emitted light will be measured by waving a mobile device (e.g. phone, tablet) over the dressing containing the sensor system. The captured data will be transmitted to healthcare professionals, processed, stored to keep a record of wound history, and used for diagnostics and therapeutics. The proposed project will benefit patients by effective diagnostics and treatment of chronic wounds. The information on wound condition will permit timely identification of hard to heal wounds and will also be used to create a feedback loop for fully optimised treatments tailored to individual patients. For example, the rate of release of anti-inflammatory drugs will be tailored based on wound condition. This is critical in terms of chronic wound management, where it has been shown that the longer the delay in administering appropriate treatment, the more difficult a wound is to heal.
more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS, Bundeswehr University Munich, 3SUN S.R.L., UNIPD, University of Regensburg +190 partnersFOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,Bundeswehr University Munich,3SUN S.R.L.,UNIPD,University of Regensburg,IDIBAPS,CIC ENERGIGUNE,University of Bremen,UNIVERSITE DE LILLE,CSIC,G.TEC MEDICAL ENGINEERING GMBH,IHP GMBH,BSL,SIXONIA TECH,TUW,NSN,HEIDELBERG MATERIALS ITALIA CEMENTI SPA,University of Nottingham,CNRS,CIBER,UNISA,ProGnomics Ltd.,Emberion Ltd,EAB,PIXIUM VISION,Polytechnic University of Milan,Trinity College Dublin, Ireland,SUSS MicroTec Lithography GmbH,Chalmers University of Technology,NanOsc AB,AMO GMBH,DI,LNE,TU Delft,UCL,BEDIMENSIONAL SPA,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,CAU,Varta Microbattery (Germany),Evonik Nutrition & Care GmbH,GRUPO ANTOLIN-INGENIERIA SA,MAGNA ELECTRONICS SWEDEN AB,MCS,Infineon Technologies (Germany),HUN-REN CENTRE FOR ENERGY RESEARCH,AIRBUS OPERATIONS SL,M-Solv,University of Sheffield,MPG,STMicroelectronics (Switzerland),BMW Group (Germany),INSTITUTO NACIONAL DE INVESTIGACION Y TECNOLOGIA AGRARIA Y ALIMENTARIA OA MP,UCLM,ABB AB,INBRAIN NEUROELECTRONICS SL,MICRO RESIST TECHNOLOGY GESELLSCHAFT FUER CHEMISCHE MATERIALIEN SPEZIELLER PHOTORESISTSYSTEME MBH,KIT,Plastic Logic (United Kingdom),VARTA INNOVATION GMBH,OINT,GRAPHENE-XT SRL,LEONARDO,Carlos III University of Madrid,BMW (Germany),Singulus (Germany),CEA,UMINHO,RWTH,VRS,CRAYONANO AS,GRAPHMATECH AB,CRF,UCL,DIPC,AALTO,Printed Electronics Ltd,Imperial,INSERM,ICFO,UniPi,UZH,CIC biomaGUNE,confinis,LHT,AIRBUS HELICOPTERS,Siemens (Germany),QMUL,FNSR,Nanesa,AIXTRON LIMITED,IAW,ARCELORMITTAL,UPSud,QURV TECHNOLOGIES SL,IMech-BAS,Naturality Research & Development,CNR,CHALMERS INDUSTRITEK,EMBERION OY,TECNIUM,UNISTRA,WUT,Mellanox Technologies (Israel),NOKIA UK LIMITED,CNIT,University of Rome Tor Vergata,TU/e,TEMAS AG TECHNOLOGY AND MANAGEMENT SERVICES,INDORAMA VENTURES FIBERS GERMANY GMBH,Bundeswehr,AVANZARE,VMI,SUSS MicroTec Photomask Equipment,TECNALIA,BOKU,University of Ulm,FSU,University of Manchester,AIXTRON SE,UT,BIOAGE,BMVg,Mellanox Technologies (United States),University of Groningen,ICN2,EVONIK CREAVIS GMBH,FAU,NanoTechLab,FHG,ITME,TUD,FIOH,NAWATECHNOLOGIES,IMEC,DALLARA AUTOMOBILI SPA,INTER-QUIMICA,DTU,SISSA,University of Zaragoza,Sonaca (Belgium),AIRBUS DEFENCE AND SPACE GMBH,Composites Evolution (United Kingdom),HCPB,UAB,NOVALIA LIMITED,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,MEDICA SPA,NPL MANAGEMENT LIMITED,SCHAFFHAUSEN INSTITUTE OF TECHNOLOGY AG,HITACHI ENERGY SWEDEN AB,BASF SE,EVONIK DEGUSSA GmbH,IMDEA NANO,Umeå University,University of Ioannina,AMALYST,TME,Airbus (Netherlands),ULB,UNITS,GRAPHENEA SEMICONDUCTOR SL,IIT,INTERNACIONAL DE COMPOSITES SA,EPFL,G TEC,EGP,Technion – Israel Institute of Technology,SPAC SPA,ICON LIFESAVER LIMITED,BRETON SPA,KI,SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,ESF,BARNICES Y PINTURAS MODERNAS SOCIEDAD ANONIMA,UNIGE,BRUNO BALDASSARI & FRATELLI SPA,Sorbonne University,UH,USTL,Universität Augsburg,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,IDIBAPS-CERCA,University of Warwick,CIC nanoGUNE,Lancaster University,PHI-STONE AG,Philipps-University of Marburg,POLYMEM,CAMBRIDGE RAMAN IMAGING LTD,EPFZ,EMPA,TEMAS SOLUTIONS GMBH,ΕΛΜΕΠΑ,FIDAMC,THALESFunder: European Commission Project Code: 881603Overall Budget: 149,703,008 EURFunder Contribution: 149,703,008 EURThis proposal describes the third core project of the Graphene Flagship. It forms the fourth phase of the FET flagship and is characterized by a continued transition towards higher technology readiness levels, without jeopardizing our strong commitment to fundamental research. Compared to the second core project, this phase includes a substantial increase in the market-motivated technological spearhead projects, which account for about 30% of the overall budget. The broader fundamental and applied research themes are pursued by 15 work packages and supported by four work packages on innovation, industrialization, dissemination and management. The consortium that is involved in this project includes over 150 academic and industrial partners in over 20 European countries.
more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2024Partners:UCLM, SIXONIA TECH, NSN, AMALYST, University of Rome Tor Vergata +186 partnersUCLM,SIXONIA TECH,NSN,AMALYST,University of Rome Tor Vergata,INDORAMA VENTURES FIBERS GERMANY GMBH,AVANZARE,UH,UNISTRA,AALTO,Imperial,INSERM,ICFO,IIT,INTERNACIONAL DE COMPOSITES SA,LNE,TU Delft,Emberion Ltd,UNISA,Trinity College Dublin, Ireland,Infineon Technologies (Germany),SCHAFFHAUSEN INSTITUTE OF TECHNOLOGY AG,NanOsc AB,STMicroelectronics (Switzerland),INBRAIN NEUROELECTRONICS SL,Siemens (Germany),MICRO RESIST TECHNOLOGY GESELLSCHAFT FUER CHEMISCHE MATERIALIEN SPEZIELLER PHOTORESISTSYSTEME MBH,TUD,ARCELORMITTAL,FIOH,UPSud,QMUL,UT,FNSR,BIOAGE,BMVg,AIXTRON LIMITED,Mellanox Technologies (United States),IMEC,DALLARA AUTOMOBILI SPA,IAW,UniPi,EMBERION OY,HCPB,ABB AB,QURV TECHNOLOGIES SL,SUSS MicroTec Photomask Equipment,MCS,HUN-REN CENTRE FOR ENERGY RESEARCH,EPFL,TECNALIA,CNR,OINT,SISSA,KIT,UCL,BOKU,IDIBAPS,Plastic Logic (United Kingdom),LEONARDO,CIC ENERGIGUNE,ULB,AIRBUS OPERATIONS SL,UMINHO,UNIPD,University of Regensburg,UNITS,G.TEC MEDICAL ENGINEERING GMBH,CIC biomaGUNE,ICON LIFESAVER LIMITED,HEIDELBERG MATERIALS ITALIA CEMENTI SPA,UAB,DI,BASF SE,CRF,GRAPHENE-XT SRL,EVONIK DEGUSSA GmbH,CAU,CEA,Varta Microbattery (Germany),GRUPO ANTOLIN-INGENIERIA SA,RWTH,BRETON SPA,IMDEA NANO,FIDAMC,CSIC,VRS,NAWATECHNOLOGIES,SUSS MicroTec Lithography GmbH,Chalmers University of Technology,THALES,UCL,DIPC,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,Bundeswehr University Munich,LHT,AIRBUS HELICOPTERS,Philipps-University of Marburg,MAGNA ELECTRONICS SWEDEN AB,3SUN S.R.L.,Printed Electronics Ltd,UZH,NOKIA UK LIMITED,confinis,TU/e,Nanesa,Bundeswehr,VMI,USTL,Universität Augsburg,EAB,BMW Group (Germany),PIXIUM VISION,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,IDIBAPS-CERCA,VARTA INNOVATION GMBH,University of Sheffield,MPG,Umeå University,University of Ioannina,IHP GMBH,BSL,University of Bremen,TECNIUM,UNIVERSITE DE LILLE,University of Manchester,INSTITUTO NACIONAL DE INVESTIGACION Y TECNOLOGIA AGRARIA Y ALIMENTARIA OA MP,TME,BEDIMENSIONAL SPA,AMO GMBH,Polytechnic University of Milan,University of Groningen,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,Carlos III University of Madrid,TUW,Singulus (Germany),University of Warwick,ICN2,CRAYONANO AS,GRAPHMATECH AB,BMW (Germany),University of Ulm,AIRBUS DEFENCE AND SPACE GMBH,University of Nottingham,POLYMEM,CNRS,CIBER,ProGnomics Ltd.,Composites Evolution (United Kingdom),KI,SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,ESF,BRUNO BALDASSARI & FRATELLI SPA,M-Solv,MEDICA SPA,FSU,AIXTRON SE,NPL MANAGEMENT LIMITED,CAMBRIDGE RAMAN IMAGING LTD,EPFZ,TEMAS SOLUTIONS GMBH,ΕΛΜΕΠΑ,CHALMERS INDUSTRITEK,FHG,ITME,NanoTechLab,CNIT,INTER-QUIMICA,DTU,University of Zaragoza,NOVALIA LIMITED,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,IMech-BAS,Naturality Research & Development,FAU,Sonaca (Belgium),GRAPHENEA SEMICONDUCTOR SL,SPAC SPA,Lancaster University,PHI-STONE AG,EGP,Airbus (Netherlands),EMPA,WUT,Mellanox Technologies (Israel),G TEC,UNIGE,Sorbonne University,CIC nanoGUNE,Technion – Israel Institute of Technology,BARNICES Y PINTURAS MODERNAS SOCIEDAD ANONIMAFunder: European Commission Project Code: 952792Overall Budget: 20,000,000 EURFunder Contribution: 20,000,000 EURThe 2D Experimental Pilot Line (2D-EPL) project will establish a European ecosystem for prototype production of Graphene and Related Materials (GRM) based electronics, photonics and sensors. The project will cover the whole value chain including tool manufacturers, chemical and material providers and pilot lines to offer prototyping services to companies, research centers and academics. The 2D-EPL targets to the adoption of GRM integration by commercial semiconductor foundries and integrated device manufacturers through technology transfer and licensing. The project is built on two pillars. In Pillar 1, the 2D-EPL will offer prototyping services for 150 and 200 mm wafers, based on the current state of the art graphene device manufacturing and integration techniques. This will ensure external users and customers are served by the 2D-EPL early in the project and guarantees the inclusion of their input in the development of the final processes by providing the specifications on required device layouts, materials and device performances. In Pillar 2, the consortium will develop a fully automated process flow on 200 and 300 mm wafers, including the growth and vacuum transfer of single crystalline graphene and TMDCs. The knowledge gained in Pillar 2 will be transferred to Pillar 1 to continuously improve the baseline process provided by the 2D-EPL. To ensure sustainability of the 2D-EPL service after the project duration, integration with EUROPRACTICE consortium will be prepared. It provides for the European actors a platform to develop smart integrated systems, from advanced prototype design to small volume production. In addition, for the efficiency of the industrial exploitation, an Industrial Advisory Board consisting mainly of leading European semiconductor manufacturers and foundries will closely track and advise the progress of the 2D-EPL. This approach will enable European players to take the lead in this emerging field of technology.
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