The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable to deal with 3D structures, defects analysis, overlay and feature size evaluation. Each of these objectives will be achieved by cooperation between key European equipment developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KTI involved with their suppliers, involvement of a strong knowledge network based on Universities of Germany, Heidelberg University Hospital, and the Netherland, TU Delft and the University of Twente, complemented with key Technology Institutes such as imec and Fraunhofer. The project addresses Section 15 “Electronics Components & Systems Process Technology, Equipment, Materials and Manufacturing”, Major Challenge 4 “Maintaining world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and Major Challenge 1 “Developing advanced logic and memory technology for nanoscale integration and application-driven performance” of the ECSEL JU Annual Work Plan 2018. As set out in the Multi Annual Strategic Plan 2018, PIn3S addresses the ambition for the European Equipment & Manufacturing industry for advanced semiconductor technologies to lead the world in miniaturization by supplying new equipment and materials approximately two years ahead of introduction of volume production of advanced semiconductor manufacturers. With the results of the Pin3S project the consortium builds on realizing IC manufacturers to migrate to the 3nm Technology node which enables a class of new products which have more functionality, more performance and are more power efficient. As such it will form the bases for innovations yet to come enabling solutions that address the societal challenges in communication, mobility, health care, security, energy and safety & security.

The I-MECH target is to provide augmented intelligence for wide range of cyber-physical systems having actively controlled moving elements, hence support development of smarter mechatronic systems. They face increasing demands on size, motion speed, precision, adaptability, self-diagnostic, connectivity, new cognitive features, etc. Fulfillment of these requirements is essential for building smart, safe and reliable production complexes. This implies completely new demands also on bottom layers of employed motion control system which cannot be routinely handled by available commercial products. On the ground of this, the main mission of this project is to bring novel intelligence into Instrumentation and Control Layers mainly by bridging the gap between latest research results and industrial practice in related model based engineering fields. Next, I-MECH will deliver new interfaces and diagnostic data quality for System Behavior Layer. It strives to provide a cutting edge reference motion control platform for non-standard applications where the control speed, precision, optimal performance, easy reconfigurability and traceability are crucial. The high added value of I-MECH reference platform will be directly verified in high-speed/big CNC machining, additive manufacturing, semicon, high-speed packaging and healthcare robotics. In these sectors, the main project pilots will be validated. However, the platform will be applicable in many other generic motion control fields. The project outputs will impact on the entire value chain of the production automation market and, through envisioned I-MECH center, create sustainable proposition for future smart industry.

The objective of POSITION-II is to bring innovation in the development and production of smart catheters by the introduction of open technology platforms for miniaturization, AD conversion at the tip, ultra-sound MEMS devices and encapsulation. Open technology platforms will generate the production volume that will enable sustainable innovation. The availability of open technology platforms will result in new instruments that have a better performance, new sensing and imaging capabilities, while the scale of volume will result in lower manufacturing costs. The production of the “brains” of these smart catheters will take place in Europe, with many European partners contributing essential technologies. The POSITION-II project will consolidate Europe’s premier position as manufacturer of cath lab infrastructure since these new smart catheters will be seamlessly integrated in the cath lab hardware and software platforms. By combining the different sensing and imaging data a more intuitive cath lab experience will be achieved. Looking forward, POSITION-II prepares the European electronics industry for the next revolution in healthcare, bioelectronics implants. Bioelectronics implants are expected to replace a considerable fraction of traditional medicine by direct stimulation of nerves. The miniaturization and soft encapsulation platforms developed in POSITION-II will be the ideal technology frame work for the manufacturing of these bioelectronics implants. The technology platforms developed in POSITION-II are demonstrated by five challenging product demonstrators covering FRR, IVUS, ICE, EP and cell therapy as well as a bioelectronics implant to treat cluster headache.

The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic technology extending the scaled Semiconductor technology roadmap to the next node in accordance to Moore’s law. These activities cover creation of Lithography equipment, new Processes & Modules and Metrology tools capable to create and deal with new 2nm node 3D structures, defect analysis, overlay and features. The topics addressed by the program relate to the ECSEL MASP 2019 Chapter 10; “Process Technology, Equipment, Materials and Manufacturing for electronic components and systems”, with emphasis on the following major challenge “the Extension of world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and “Developing Technology for heterogeneous System-on-Chip (SoC) Integration” of the ECSEL JU Annual Work Plan 2019. The relation of the IT2 project to world leadership regards the extension of the scaled semiconductor technology roadmaps and thereby maintain competence in advanced More Moore technology in Europe to support leading edge manufacturing. The relation of the IT2 project to the Developing Technology for heterogeneous System-on-chip Integration comes from activities regarding “System Scaling” in which technology is developed that enables wafer-to-wafer bonding creating 3D heterogeneous solutions with the aim to resolve performance limitations in power and data congestion. In regard to the annual work plan 2019, the IT2 project support the ECSEL JU objectives by contribution to the development of a strong and competitive Electronic Components and Systems (ECS) by involving many of the equipment and tool developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KLA along the value chain and knowledge institutes such as ARCNL, imec, PTB, TNO and TU/e. And by stimulating a dynamic ecosystem through through the involvement of SMEs like IBS, Recif, Reden and Unity.

IMOCO4.E targets to provide vertically distributed edge-to-cloud intelligence for machines, robots and other human-in-the-loop cyber-physical systems having actively controlled moving elements. They face ever-growing requirements on long-term energy efficiency, size, motion speed, precision, adaptability, self-diagnostic, secure connectivity or new human-cognitive features. IMOCO4.E strives to perceive and understand complex machines and robots. The two main pillars of the project are digital twins and AI principles (machine/deep learning). These pillars build on the I-MECH reference framework and methodology, by adding new tools to layer 3 that delivers an intelligible view on the system, from the initial design throughout its entire life cycle. For effective employment, completely new demands are created on the Edge layers (Layer 1) of the motion control systems (including variable speed drives and smart sensors) which cannot be routinely handled via available commercial products. Based on this, the subsequent mission is to bring adequate edge intelligence into the Instrumentation and Control Layers, to analyse and process machine data at the appropriate levels of the feedback control loops and to synchronise the digital twins with either simulated or real-time physical world. At all levels, AI techniques are employable. Summing up, IMOCO4.E strives to deliver a reference platform consisting of AI and digital twin toolchains and a set of mating building blocks for resilient manufacturing applications. The optimal energy efficient performance and easy (re)configurability, traceability and cyber-security are crucial. The IMOCO4.E reference platform benefits will be directly verified in applications for semicon, packaging, industrial robotics and healthcare. Additionally, the project demonstrates the results in other generic “motion-control-centred” domains. The project outputs will affect the entire value chain of the production automation and application markets.