Manufacturers of automated systems and the manufacturers of the components used in these systems have been allocating an enormous amount of time and effort in the past years developing and conducting research on automated systems. The effort spent has resulted in the availability of prototypes demonstrating new capabilities as well as the introduction of such systems to the market within different domains. Manufacturers of these systems need to make sure that the systems function in the intended way and according to specifications which is not a trivial task as system complexity rises dramatically the more integrated and interconnected these systems become with the addition of automated functionality and features to them. With rising complexity, unknown emerging properties of the system may come to the surface making it necessary to conduct thorough verification and validation (V&V) of these systems. VALU3S aims to design, implement and evaluate state-of-the-art V&V methods and tools in order to reduce the time and cost needed to verify and validate automated systems with respect to safety, cybersecurity and privacy (SCP) requirements. This will ensure that European manufacturers of automated systems remain competitive and that they remain world leaders. To this end, a multi-domain framework is designed and evaluated with the aim to create a clear structure around the components and elements needed to conduct V&V process through identification and classification of evaluation methods, tools, environments and concepts that are needed to verify and validate automated systems with respect to SCP requirements. The implemented V&V methods as well as improved process workflows and tools will also be evaluated in the project using a comprehensive set of demonstrators built from 13 use cases with specific SCP requirements from 6 domains of automotive, industrial robotics, agriculture, Aerospace, railway and health.

Wireless Chip-to-Chip (C2C) communication and wireless links between printed circuit boards operating as Multiple Input Multiple Output devices need to become dominant features of future generations of integrated circuits and chip architectures. They will be able to overcome the information bottleneck due to wired connections and will lead the semiconductor industry into a new More-Than-Moore era. Designing the architecture of these wireless C2C networks is, however, impossible today based on standard engineering design tools. Efficient modelling strategies for describing noisy electromagnetic fields in complex environments are necessary for developing these new chip architectures and wireless interconnectors. Device modelling and chip optimization procedures need to be based on the underlying physics for determining the electromagnetic fields, the noise models and complex interference pattern. In addition, they need to take into account input signals of modern communication systems being modulated, coded, noisy and eventually disturbed by other signals and thus extremely complex. Recent advances both in electrical engineering and mathematical physics make it possible to deliver the breakthroughs necessary to enable this future emerging wireless C2C technology by creating a revolutionary electromagnetic field simulation toolbox. Increasingly sophisticated physical models of wireless interconnects and associated signal processing strategies and new insight into wave modelling in complex environments based on dynamical systems theory and random matrix theory make it possible to envisage wireless communication on a chip level. This opens up completely new pathways for chip design, for carrier frequency ranges as well as for energy efficiency and miniaturisation, which will shape the electronic consumer market in the 21st century.