Okmetic
Okmetic
20 Projects, page 1 of 4
Open Access Mandate for Publications and Research data assignment_turned_in Project2024 - 2027Partners:UCC, IQM, UCL, STMicroelectronics (Switzerland), SUPRA +27 partnersUCC,IQM,UCL,STMicroelectronics (Switzerland),SUPRA,PICOSUN OY,BLUEFORS CRYOGENICS OY,ST,STM CROLLES,IMEC,INCIZE,TU Delft,BESI,FHG,GLOBAL TCAD SOLUTIONS GMBH,Infineon Technologies (Germany),QBLOX BV,NANOLAYERS OU,TNO,Okmetic,Lund University,ISL,QUANTROLOX FINLAND OY,TAMPERE UNIVERSITY,C2AMPS AB,CEA,QUOBLY,ALICE & BOB,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,SEMIQON TECHNOLOGIES OY,Single Quantum,Technische Universität BraunschweigFunder: European Commission Project Code: 101139908Overall Budget: 34,604,400 EURFunder Contribution: 11,267,700 EURThe rise of quantum technology has opened the eyes of the ICT industry with respect to cryogenics. It is considered an enabler bringing in quantum functionalities and enhanced system performance and we are observing a massive growth of cryogenics from coolers to cryogenic electronics and photonics. ArCTIC is a joint effort of top European RTOs, industrial fabrication facilities, and leading application partners (23 industrial among which 14 SMEs, 7 RTO, 6 academic), sharing the vision to take a joint EU step towards the era of cryogenic classical and quantum microsystems. We aim to close the gap between qubit research and interfacing control machinery, highly needed for scaled-up quantum systems. The main goal of ArCTIC is to develop scalable cryogenic ICT microsystems and control technology for quantum processors. The technologies developed will have applications in many fields from sensing to communication, leading to important cross-fertilization that will strengthen the forming European ecosystem on cryogenic classical and quantum microsystems. ArCTIC will advance semiconductor technologies and materials, and tailor these for QT requirements and cryogenic applications. Multi-scale physics and data-driven models, cryogenic PDK modelling, device characterization, circuit design activities will support the development of cryogenic microelectronics. We will develop quantum processor platforms and broaden the applicability of microelectronic devices and circuits for cryogenic operation by developing cryo-compatible ultra-low loss substrates and thin-films, microelectronic and photonic circuits, semiconductor packaging and heterogeneous-integration techniques and benchmark the developed technologies. Scientific and Industrial ArCTIC-demonstrators and applications are driving our developments enabling the European industry to maintain and expand its leading edge in semiconductor components and processes and QT and strengthen sustainable manufacturing technologies
more_vert Open Access Mandate for Publications assignment_turned_in Project2018 - 2021Partners:STARHOME, DAT.Mobility, EPOS EMBEDDED CORE & POWER SYSTEMS GMBH & CO. KG, University of Bucharest, University of Turku +59 partnersSTARHOME,DAT.Mobility,EPOS EMBEDDED CORE & POWER SYSTEMS GMBH & CO. KG,University of Bucharest,University of Turku,ANYWI,TTTECH AUTO AG,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,TTTech Computertechnik (Austria),INFINEON TECHNOLOGIES LINZ GMBH & CO KG,IRIZAR,Scania (Sweden),VIF,RELAB,G.N.T. INFORMATION SYSTEMS S.A.,AVL,TECNALIA,TAMPERE UNIVERSITY OF TECHNOLOGY,Innoluce,Latvian Academy of Sciences,POLITO,UAB,AVL TURKIYE,Okmetic,TTS KEHITYS OY,UAM,Graz University of Technology,FORD OTOMOTIV SANAYI ANONIM SIRKETI,VIDEANTIS GMBH,Murata (Finland),Infineon Technologies (Austria),NOORD-BRABANT,BMW (Germany),MASERATI SPA,FAU,KTH,IECS,CRF,ITI,IDEAS & MOTION SRL,NXP (Netherlands),TAMPERE UNIVERSITY,FICOSA ADAS, S.L.,TTTech Germany GmbH,TU Delft,IMEC,Murata (Japan),NSNFINLAND,Infineon Technologies (Germany),HABITUS RESEARCH,Robert Bosch (Germany),UNIMORE,Offenburg University of Applied Sciences,ROVIMATICA,TU/e,TENNECO AUTOMOTIVE EUROPE BVBA,IDIADA,BMW Group (Germany),CISC Semiconductor (Austria),AUTOCAR MEDIA GROUP LTD,CSIC,MATTERSOFT,AITEK SPA,TNOFunder: European Commission Project Code: 783190Overall Budget: 50,293,700 EURFunder Contribution: 14,368,400 EURThe ambition of PRYSTINE is to strengthen and to extend traditional core competencies of the European industry, research and universities in smart mobility and in particular the electronic component and systems and cyber-physical systems domains. PRYSTINE's target is to realize Fail-operational Urban Surround perceptION (FUSION) which is based on robust Radar and LiDAR sensor fusion and control functions in order to enable safe automated driving in urban and rural environments. Therefore, PRYSTINE's high-level goals are: 1. Enhanced reliability and performance, reduced cost and power of FUSION components 2. Dependable embedded control by co-integration of signal processing and AI approaches for FUSION 3. Optimized E/E architecture enabling FUSION-based automated vehicles 4. Fail-operational systems for urban and rural environments based on FUSION PRYSTINE will deliver (a) fail-operational sensor-fusion framework on component level, (b) dependable embedded E/E architectures, and (c) safety compliant integration of Artificial Intelligence (AI) approaches for object recognition, scene understanding, and decision making within automotive applications. The resulting reference FUSION hardware/software architectures and reliable components for autonomous systems will be validated in in 22 industrial demonstrators, such as: 1. Fail-operational autonomous driving platform 2. An electrical and highly automated commercial truck equipped with new FUSION components (such as LiDAR, Radar, camera systems, safety controllers) for advanced perception 3. Highly connected passenger car anticipating traffic situations 4. Sensor fusion in human-machine interfaces for fail-operational control transition in highly automated vehicles PRYSTINE’s well-balanced, value chain oriented consortium, is composed of 60 project partners from 14 different European and non-European countries, including leading automotive OEMs, semiconductor companies, technology partners, and research institutes.
more_vert Open Access Mandate for Publications assignment_turned_in Project2018 - 2021Partners:TU Delft, JUMISC FOUNDATION JESUS USON MINIMALLY INVASIVESUR, INESC ID, IPDIA, Salvia BioElectronics +45 partnersTU Delft,JUMISC FOUNDATION JESUS USON MINIMALLY INVASIVESUR,INESC ID,IPDIA,Salvia BioElectronics,University of Zaragoza,3D-Micromac AG,FHG,AALTO,Creganna,ALPHASIP SANTA CLARA NANOMEDICAL USA NANOCARDIOCOCO SOCIEDAD LIMITADA,IMEC,FINETECH GMBH & CO KG,MCS,HUN-REN CENTRE FOR ENERGY RESEARCH,PICOSUN OY,Analog Devices (Ireland),Philips (France),Complutense University of Madrid,UCC,JOHNSON MATTHEY PIEZO PRODUCTS GMBH,CIKAUTXO S COOP,REDEN,PDM&FC,Philips (Netherlands),FBK,VERMON,Brio Apps AlphaSIP,COMELEC,DYB DYCONEX SA DYCONEX LTD,Integer,IBERHOSPITEX SA,Roma Tre University,OSYPKA,CEA,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,IMS,Okmetic,PHILIPS ELECTRONICS NEDERLAND B.V.,PHILIPS MEDICAL SYSTEMS NEDERLAND,CIBER,TU/e,Silex Microsystems (Sweden),CORTEC,IT,HUN-REN RESEARCH CENTRE FOR NATURAL SCIENCES,TIKITIN,AMIC,CATENA GERMANY GMBH,CatenaFunder: European Commission Project Code: 783132Overall Budget: 40,947,300 EURFunder Contribution: 10,419,000 EURThe objective of POSITION-II is to bring innovation in the development and production of smart catheters by the introduction of open technology platforms for miniaturization, AD conversion at the tip, ultra-sound MEMS devices and encapsulation. Open technology platforms will generate the production volume that will enable sustainable innovation. The availability of open technology platforms will result in new instruments that have a better performance, new sensing and imaging capabilities, while the scale of volume will result in lower manufacturing costs. The production of the “brains” of these smart catheters will take place in Europe, with many European partners contributing essential technologies. The POSITION-II project will consolidate Europe’s premier position as manufacturer of cath lab infrastructure since these new smart catheters will be seamlessly integrated in the cath lab hardware and software platforms. By combining the different sensing and imaging data a more intuitive cath lab experience will be achieved. Looking forward, POSITION-II prepares the European electronics industry for the next revolution in healthcare, bioelectronics implants. Bioelectronics implants are expected to replace a considerable fraction of traditional medicine by direct stimulation of nerves. The miniaturization and soft encapsulation platforms developed in POSITION-II will be the ideal technology frame work for the manufacturing of these bioelectronics implants. The technology platforms developed in POSITION-II are demonstrated by five challenging product demonstrators covering FRR, IVUS, ICE, EP and cell therapy as well as a bioelectronics implant to treat cluster headache.
more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:UCC, MENARINI SILICON BIOSYSTEMS SPA, B. Braun (Germany), BSL, TUW +63 partnersUCC,MENARINI SILICON BIOSYSTEMS SPA,B. Braun (Germany),BSL,TUW,PHILIPS ELECTRONICS NEDERLAND B.V.,ANSEM,University of Turku,GAUDLITZ GMBH,INPHER SARL,MICRONIT BV,MicroLIQUID (Spain),HI Iberia (Spain),UNIPV,MCS,HUN-REN CENTRE FOR ENERGY RESEARCH,EMFIT,BESI,STMicroelectronics (Switzerland),Okmetic,IMEC-NL,PRECORDIOR OY,OSYPKA,CSEM,INSTITUTUL NATIONAL DE CERCETAREDEZVOLTARE PENTRU MICROTEHNOLOGIE,University of Florence,INESC ID,OY EVERON AB,PICOSUN OY,Salvia BioElectronics,TU Delft,INESC MICROSISTEMAS E NANOTECNOLGIAS-INSTITUTO DE,AbbVie Ireland NL B.V.,TU/e,REMOTEA OY,IRBLEIDA,EVG,THALES DIS FINLAND OY,SILICONGATE LDA,3db,www.gobiond.com,Microfluidic ChipShop (Germany),KIT,Micronit Microfluidics (Netherlands),University of Freiburg,UM,IHS WEIGLING SOCIEDAD LIMITADA,BEONCHIP SL,UPV/EHU,DYB DYCONEX SA DYCONEX LTD,Integer,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,PDM&FC,University of Zaragoza,INL,AESCULAP AG,INSPHERO,FHG,ICSENSE,IMEC,CORTEC,AEDUS SPACE KORLATOLT FELELOSSEGU TARSASAG,Roma Tre University,Besi Netherlands BV,IT,FUNDACION INSTITUTO DE INVESTIGACION SANITARIA ARAGON,TNO,PHILIPS MEDICAL SYSTEMS NEDERLANDFunder: European Commission Project Code: 876190Overall Budget: 65,224,200 EURFunder Contribution: 16,869,800 EURCompared to the pace of innovation in electronic consumer products, the pace of innovation for medical devices is lagging behind. It is the overarching objective of Moore4Medical to accelerate innovation in electronic medical devices. Moore4Medical emerging medical applications that offer significant new opportunities for the ECS industry including: active implantable devices (bioelectronic medicines), organ-on-chip, drug adherence monitoring, smart ultrasound, radiation free interventions and continuous monitoring. The new technologies will help fighting the increasing cost of healthcare by: reducing the need for hospitalization, helping the development of personalized therapies, and realizing intelligent point-of-care diagnostic tools. Moore4Medical will bring together 68 specialists from 12 countries who will develop open technology platforms for these emerging fields to help them bridge “the Valley of Death” in shorter time and at lower cost. Open technology platforms used by multiple users for multiple applications with the prospect of medium to high volume markets are an attractive proposition for the European ECS industry. The combination of typical MedTech applications with an ECS style platform approach will enhance the competitiveness for the emerging medical domains addressed in Moore4Medical. With value and IP moving from the technology level towards applications and solutions, defragmentation and open technology platforms will be key in acquiring and maintaining a premier position for Europe in the forefront of affordable healthcare
more_vert assignment_turned_in Project2011 - 2014Partners:FHG, Solmates, EPCOS AG, Epcos NL, University of Twente +11 partnersFHG,Solmates,EPCOS AG,Epcos NL,University of Twente,CAU,TNO,Okmetic,Landshut Silicon Foundry,MASER,BTE,Silex Microsystems (Sweden),MISSING_LEGAL_NAME,PICOSUN OY,aixACCT,VALTION TALOUDELLINEN TUTKIMUSKESKUSFunder: European Commission Project Code: 270692more_vert
chevron_left - 1
- 2
- 3
- 4
chevron_right
