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BESI

BESI AUSTRIA GMBH
Country: Austria
14 Projects, page 1 of 3
  • Funder: European Commission Project Code: 101139908
    Overall Budget: 34,604,400 EURFunder Contribution: 11,267,700 EUR

    The rise of quantum technology has opened the eyes of the ICT industry with respect to cryogenics. It is considered an enabler bringing in quantum functionalities and enhanced system performance and we are observing a massive growth of cryogenics from coolers to cryogenic electronics and photonics. ArCTIC is a joint effort of top European RTOs, industrial fabrication facilities, and leading application partners (23 industrial among which 14 SMEs, 7 RTO, 6 academic), sharing the vision to take a joint EU step towards the era of cryogenic classical and quantum microsystems. We aim to close the gap between qubit research and interfacing control machinery, highly needed for scaled-up quantum systems. The main goal of ArCTIC is to develop scalable cryogenic ICT microsystems and control technology for quantum processors. The technologies developed will have applications in many fields from sensing to communication, leading to important cross-fertilization that will strengthen the forming European ecosystem on cryogenic classical and quantum microsystems. ArCTIC will advance semiconductor technologies and materials, and tailor these for QT requirements and cryogenic applications. Multi-scale physics and data-driven models, cryogenic PDK modelling, device characterization, circuit design activities will support the development of cryogenic microelectronics. We will develop quantum processor platforms and broaden the applicability of microelectronic devices and circuits for cryogenic operation by developing cryo-compatible ultra-low loss substrates and thin-films, microelectronic and photonic circuits, semiconductor packaging and heterogeneous-integration techniques and benchmark the developed technologies. Scientific and Industrial ArCTIC-demonstrators and applications are driving our developments enabling the European industry to maintain and expand its leading edge in semiconductor components and processes and QT and strengthen sustainable manufacturing technologies

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  • Funder: European Commission Project Code: 737497
    Overall Budget: 29,735,000 EURFunder Contribution: 7,203,640 EUR

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  • Funder: European Commission Project Code: 876190
    Overall Budget: 65,224,200 EURFunder Contribution: 16,869,800 EUR

    Compared to the pace of innovation in electronic consumer products, the pace of innovation for medical devices is lagging behind. It is the overarching objective of Moore4Medical to accelerate innovation in electronic medical devices. Moore4Medical emerging medical applications that offer significant new opportunities for the ECS industry including: active implantable devices (bioelectronic medicines), organ-on-chip, drug adherence monitoring, smart ultrasound, radiation free interventions and continuous monitoring. The new technologies will help fighting the increasing cost of healthcare by: reducing the need for hospitalization, helping the development of personalized therapies, and realizing intelligent point-of-care diagnostic tools. Moore4Medical will bring together 68 specialists from 12 countries who will develop open technology platforms for these emerging fields to help them bridge “the Valley of Death” in shorter time and at lower cost. Open technology platforms used by multiple users for multiple applications with the prospect of medium to high volume markets are an attractive proposition for the European ECS industry. The combination of typical MedTech applications with an ECS style platform approach will enhance the competitiveness for the emerging medical domains addressed in Moore4Medical. With value and IP moving from the technology level towards applications and solutions, defragmentation and open technology platforms will be key in acquiring and maintaining a premier position for Europe in the forefront of affordable healthcare

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  • Funder: European Commission Project Code: 737417
    Overall Budget: 180,318,000 EURFunder Contribution: 28,046,200 EUR

    R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction (ref. to COP21 Agreement ), as well as Sustainable Environment through electric mobility and industrial power efficiency. ● Development and demonstration of a brand new 300mm advanced manufacturing facility addressing a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) ● Improvement in productivity and competitiveness of integrated IC solutions for smart power and power discrete technologies. The strategy of the project is the following: ● The Pilot Line will enable the realization of sub-100nm Smart Power processes, starting from the 90nm BCD10 process, taking profit from the advanced and peculiar equipments available only for 300mm wafer size. ● The availability of a 300mm full processing line will also exploit the portability to 300mm of the most critical and expensive process steps devoted to power discrete devices. ● The Pilot Line will build on Digital Factory and Industry 4.0 principles, enforcing a flexible, adaptive and reliable facility, in order to investigate also the synergy and economic feasibility of supporting both Smart Power and power discrete processes in the same manufacturing line. ● The application of such technologies will be a breakthrough enabler for Energy Efficiency and CO2 Reduction worldwide, in line with COP21’s global action plan. The Pilot Line is based on three main pillars: 1. Market driven continuous innovation on smart-power and power discrete; 2. Industrial policy focused on high quality and mass production’s cost optimization; 3. Set the ground for future wafer upgrade of “More than Moore” disruptive technologies (e.g. advanced MEMS manufacturing, now at 200mm)

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  • Funder: European Commission Project Code: 101007322
    Overall Budget: 21,707,000 EURFunder Contribution: 6,548,520 EUR

    Over the past 60+ years CMOS-based digital computing has giving rise to ever-greater computational performance, „big data“-based business models and the accelerating digital transformation of modern economies. However, the ever-growing amounts of data to be handled and the increasing complexity of today’s tasks for high performance computing (HPC) are becoming unmanageable as the data handling and energy consumption of HPCs, server farms and cloud services grow to unsustainable levels. New concepts and technologies are needed. One such HPC technology is Quantum computing (QC). QC utilizes so-called quantum bits (qubits) to perform complex calculations fundamentally much faster than a conventional digital-bit computers can. First quantum computer prototypes have been created. Superconducting Josephson junctions (SJJs) have been shown to be extremely promising qubit candidates to achieve a significant nonlinear increase of computational power with the number of qubits. For novel materials there is a great challenge yet opportunity in Europe to create a complete value chain for SSJs and QCs. Such a complete value chain will contribute to Europe’s technology sovereignty. The MATQu project aims at validating the technology options to produce SJJs on industrial 300 mm silicon-based process flows. It covers substrate technology, superconducting metals, resonators, through-wafer-via holes, 3D integration, and variability characterization. These will be assessed with respect to integration practices of qubits. Core substrate and process technologies with high quality factors, improved material deposition on large-substrates, and increased critical temperature for superconducting operation, will be developed and validated. The MATQu partners complement each other in an optimal way across the value chain to create a substantial competitive advantage, e.g. faster time-to-market and roll-out of technologies and materials for better Josephson junctions for quantum computing.

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