SENSAP SWISS AG
SENSAP SWISS AG
3 Projects, page 1 of 1
Open Access Mandate for Publications and Research data assignment_turned_in Project2019 - 2023Partners:KMWE, Brunel University London, INNOVALIA, IPC, Toshulin (Czechia) +31 partnersKMWE,Brunel University London,INNOVALIA,IPC,Toshulin (Czechia),ESTAMPACIONES MAYO SA,DANOBAT,MARLEGNO,SENSAP SWISS AG,THINKING ADDITIVE LTD,Siemens (Germany),ATLANTIS ENGINEERING,INTERNATIONAL DATA SPACES ASSOCIATION IDSA,LUCCHINI RS SPA,INEGI,ESI (Germany),CORE,TAMPERE UNIVERSITY,AIMEN,SOFIES SA,CRF,AUSTRIAN STANDARDS INSTITUTE OSTERREICHISCHES NORMUNGSINSTITUT,IDEKO,DSS SUSTAINABLE SOLUTIONS SWITZERLAND SA,ESI (France),TTS TECHNOLOGY TRANSFER SYSTEMS SRL,ITI,SCM GROUP SPA,BIBA,FHG,FAGOR ARRASATE S COOP,Holonix (Italy),VUT,KOPLAST EKSTRUZIJA D.O.O,ISOKON,Trimek (Spain)Funder: European Commission Project Code: 869991Overall Budget: 16,904,200 EURFunder Contribution: 14,028,000 EUREurope is still lacking an efficient systemic multi-level approach that enables a recursive, cost-effective, holistic and integrated application of circular principles to the digital uplifting of factory 4.0 capital investments; addressing issues at product, process, system as well as the entire value-chain levels, integrating best practices from emerging enabling digital technologies and avoid a two speed digital transformation across industries in different sectors. LEVEL-UP will offer a scalable platform covering the overall lifecycle, ranging from the digital twins setup, modernisation actions to diagnose and predict the operation of physical assets, to the refurbishment and remanufacturing activities towards end of life. In-situ repair technologies and the redesign for new upgraded components will be facilitated through virtual simulations for increased performance and lifetime. LEVEL-UP will therefore comprise new hardware and software components interfaced with the current facilities through IoT and data-management platforms, while being orchestrated through eight (8) scalable strategies at component, work-station and shopfloor level. The actions for modernising, upgrading, refurbishing, remanufacturing, and recycling will be structured and formalised into ten (10) special Protocols, linked with an Industrial Digital Thread weaving a seamless digital integration with all actors in the value chain for improved future iterations. LEVEL-UP will be demonstrated in 7 demo sites from different sectors. The impact of LEVEL-UP to the European manufacturing industry, but also the society itself, can be sum-marised in the following (with a horizon of 4 years after project ends): (i) increase of the material and re-source efficiency by 11.5%, (ii) increased reliability by 16% of the equipment in an extended lifetime by 20%, (iii) over 50% increase of the Return on Investment (ROI), (iv) about 810 new jobs created and (v) over 80M EUR ROI for the consortium.
more_vert assignment_turned_in Project2014 - 2017Partners:ICCS, BM, IGPF, Vitrociset (Italy), EURECAT +6 partnersICCS,BM,IGPF,Vitrociset (Italy),EURECAT,SENSAP SA,SENSAP SWISS AG,Sensing & Control Systems (Spain),University of Glasgow,IN2,Regione CampaniaFunder: European Commission Project Code: 606853more_vert Open Access Mandate for Publications assignment_turned_in Project2018 - 2022Partners:Alpes Lasers (Switzerland), FHG, BRIGHTERWAVE OY, FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS, TAMPERE UNIVERSITY OF TECHNOLOGY +13 partnersAlpes Lasers (Switzerland),FHG,BRIGHTERWAVE OY,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,TAMPERE UNIVERSITY OF TECHNOLOGY,SENSAP SWISS AG,PE,Brunel University London,SHADOW,TAMPERE UNIVERSITY,FZU,FICONTEC SERVICE GMBH,ATLANTIS ENGINEERING,FILAR-OPTOMATERIALS SRL,Polytechnic University of Milan,CORE,Holonix (Italy),SACMI IMOLA SCFunder: European Commission Project Code: 820677Overall Budget: 7,997,970 EURFunder Contribution: 7,997,970 EURAdvances in optoelectronics technologies is causing a revolution in consumer electronic goods, solar energy, communications, LED, industrial laser, and other fields. At present, the optoelectrical manufacturing is facing significant challenges in dealing with the evolution of the equipment, instrumentation and manufacturing processes they support. The industry is striving for higher customisation and individualisation, implying that systems configurations need to change more frequently and dynamically. IQONIC will offer a scalable zero defect manufacturing platform covering the overall process chain of optoelectrical parts. IQONIC covers the design of new optoelectrical components and their optimised process chain, their assembly process, as well as their disassembly and reintroduction into the value chain. IQONIC will therefore comprise new hardware and software components interfaced with the current facilities through internet of things and data-management platforms, while being orchestrated through eight (8) scalable strategies at component, work-station and shopfloor level. The IQONIC technologies will be demonstrated in 4 demo sites covering a wide range of products and processes. The impact of IQONIC to the European optoelectronics manufacturing industry, but also the society itself, can be summarised in the following (with a horizon of 4 years after project ends): (i) increase of the in-service efficiency by 22%, (ii) increased flexibility with 16% faster reconfiguration times, (iii) 10% reduction in production costs through recycled components and materials, (iv) improved designs for assembly and disassembly and, (v) about 400 new jobs created and (vi) over 39 MEUR ROI for the consortium. To do that we have brought together a total of seventeen (17) EU-based partners, representing both industry and academia, having ample experience in cutting-edge technologies and active presence in the EU photonics and manufacturing.
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