NanOsc AB
NanOsc AB
9 Projects, page 1 of 2
assignment_turned_in Project2010 - 2013Partners:CEA, IN SILICIO, University of Würzburg, University of Twente, NanOsc AB +3 partnersCEA,IN SILICIO,University of Würzburg,University of Twente,NanOsc AB,NTNU,University of Groningen,TU DelftFunder: European Commission Project Code: 257159more_vert - QUB,INL,NanOsc AB,TUD,CNRS,CEA,SIVERS IMA AKTIEBOLAG,Thalgo (France)Funder: European Commission Project Code: 317950
more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2024Partners:HEIDELBERG MATERIALS ITALIA CEMENTI SPA, CSIC, TECNIUM, UH, UCL +182 partnersHEIDELBERG MATERIALS ITALIA CEMENTI SPA,CSIC,TECNIUM,UH,UCL,UCLM,CIC ENERGIGUNE,FNSR,Technion – Israel Institute of Technology,Philipps-University of Marburg,Varta Microbattery (Germany),HMU,Bundeswehr University Munich,EVONIK DEGUSSA GmbH,INTERNACIONAL DE COMPOSITES SA,NOKIA UK LIMITED,OINT,3SUN S.R.L.,TUD,HUN-REN CENTRE FOR ENERGY RESEARCH,INSERM,NanOsc AB,AIRBUS OPERATIONS SL,CNIT,CHALMERS INDUSTRITEK,Lancaster University,PHI-STONE AG,UDL,Unisa,BRETON SPA,CAMBRIDGE RAMAN IMAGING LTD,IMEC,BRUNO BALDASSARI & FRATELLI SPA,UNIPD,University of Warwick,UNITS,AIXTRON LIMITED,AALTO,MEDICA SPA,TCD,UAB,Plastic Logic (United Kingdom),Naturality Research & Development,AIRBUS HELICOPTERS,SISSA,University of Groningen,CRAYONANO AS,QMUL,TU/e,TU Delft,IHP GMBH,BSL,KIT,CIC biomaGUNE,Universität Augsburg,University of Ioannina,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,Printed Electronics Ltd,BARNICES Y PINTURAS MODERNAS SOCIEDAD ANONIMA,LNE,UT,STMicroelectronics (Switzerland),TME,UNIVERSITE DE LILLE,UoN,EGP,RWTH,UniPi,ULB,CIC nanoGUNE,ETHZ,FAU,KI,SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,MCS,Imperial,EMPA,TECNALIA,BMW (Germany),IMDEA NANO,Composites Evolution (United Kingdom),University of Regensburg,University of Bremen,G.TEC MEDICAL ENGINEERING GMBH,UNISTRA,VRS,UZH,INTER-QUIMICA,TUW,AMALYST,BEDIMENSIONAL SPA,INSTITUTO NACIONAL DE INVESTIGACION Y TECNOLOGIA AGRARIA Y ALIMENTARIA OA MP,INBRAIN NEUROELECTRONICS SL,LHT,Nanesa,DALLARA AUTOMOBILI SPA,CNRS,AMO GMBH,AIRBUS DEFENCE AND SPACE GMBH,AVANZARE,CNR,Carlos III University of Madrid,Sorbonne University,UMINHO,UCL,FIOH,University of Zaragoza,IIT,confinis,BMVg,CIBER,NSN,PIXIUM VISION,BOKU,NPL MANAGEMENT LIMITED,Chalmers University of Technology,Singulus (Germany),TEMAS SOLUTIONS GMBH,Emberion Ltd,ITME,ICFO,IDIBAPS-CERCA,G TEC,EMBERION OY,GRAPHMATECH AB,CAU,UNIGE,Siemens (Germany),CEA,M-Solv,BASF SE,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,MAGNA ELECTRONICS SWEDEN AB,ProGnomics Ltd.,DIPC,ICN2,GRAPHENEA SEMICONDUCTOR SL,MPG,NanoTechLab,IDIBAPS,IAW,ESF,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,SCHAFFHAUSEN INSTITUTE OF TECHNOLOGY AG,POLYMEM,Polytechnic University of Milan,University of Ulm,FHG,Umeå University,SUSS MicroTec Lithography GmbH,DTU,EPFL,DI,WUT,VARTA INNOVATION GMBH,Sonaca (Belgium),IMech-BAS,CRF,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,THALES,UPSud,QURV TECHNOLOGIES SL,University of Sheffield,University of Rome Tor Vergata,BIOAGE,FSU,University of Manchester,FIDAMC,AIXTRON SE,GRUPO ANTOLIN-INGENIERIA SA,SUSS MicroTec Photomask Equipment,ICON LIFESAVER LIMITED,NAWATECHNOLOGIES,ABB AB,HCPB,GRAPHENE-XT SRL,NOVALIA LIMITED,EAB,Mellanox Technologies (Israel),ARCELORMITTAL,INDORAMA VENTURES FIBERS GERMANY GMBH,SIXONIA TECH,Infineon Technologies (Germany),LEONARDO,VMI,MICRO RESIST TECHNOLOGY GESELLSCHAFT FUER CHEMISCHE MATERIALIEN SPEZIELLER PHOTORESISTSYSTEME MBH,SPAC SPAFunder: European Commission Project Code: 952792Overall Budget: 20,000,000 EURFunder Contribution: 20,000,000 EURThe 2D Experimental Pilot Line (2D-EPL) project will establish a European ecosystem for prototype production of Graphene and Related Materials (GRM) based electronics, photonics and sensors. The project will cover the whole value chain including tool manufacturers, chemical and material providers and pilot lines to offer prototyping services to companies, research centers and academics. The 2D-EPL targets to the adoption of GRM integration by commercial semiconductor foundries and integrated device manufacturers through technology transfer and licensing. The project is built on two pillars. In Pillar 1, the 2D-EPL will offer prototyping services for 150 and 200 mm wafers, based on the current state of the art graphene device manufacturing and integration techniques. This will ensure external users and customers are served by the 2D-EPL early in the project and guarantees the inclusion of their input in the development of the final processes by providing the specifications on required device layouts, materials and device performances. In Pillar 2, the consortium will develop a fully automated process flow on 200 and 300 mm wafers, including the growth and vacuum transfer of single crystalline graphene and TMDCs. The knowledge gained in Pillar 2 will be transferred to Pillar 1 to continuously improve the baseline process provided by the 2D-EPL. To ensure sustainability of the 2D-EPL service after the project duration, integration with EUROPRACTICE consortium will be prepared. It provides for the European actors a platform to develop smart integrated systems, from advanced prototype design to small volume production. In addition, for the efficiency of the industrial exploitation, an Industrial Advisory Board consisting mainly of leading European semiconductor manufacturers and foundries will closely track and advise the progress of the 2D-EPL. This approach will enable European players to take the lead in this emerging field of technology.
more_vert Open Access Mandate for Publications assignment_turned_in Project2018 - 2020Partners:HEIDELBERG MATERIALS ITALIA CEMENTI SPA, CSIC, TECNIUM, University of Warwick, AALTO +189 partnersHEIDELBERG MATERIALS ITALIA CEMENTI SPA,CSIC,TECNIUM,University of Warwick,AALTO,MEDICA SPA,TCD,Naturality Research & Development,AIRBUS HELICOPTERS,SISSA,CRAYONANO AS,UCL,UCLM,CIC ENERGIGUNE,CNRS,AMO GMBH,AIRBUS DEFENCE AND SPACE GMBH,AVANZARE,UNIBAS,HUN-REN CENTRE FOR ENERGY RESEARCH,Carlos III University of Madrid,Sorbonne University,UMINHO,UCL,FIOH,University of Zaragoza,INSERM,NanOsc AB,AIRBUS OPERATIONS SL,confinis,BMVg,CIBER,NSN,DropSens S.L.,PIXIUM VISION,BOKU,UAB,UZH,INTER-QUIMICA,TUW,CNIT,CHALMERS INDUSTRITEK,UniPi,ULB,ETHZ,FAU,KI,UOXF,SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,BSL,KIT,MCS,EVONIK CREAVIS GMBH,CIC biomaGUNE,Universität Augsburg,Imperial,EMPA,University of Ioannina,TECNALIA,FBK,BMW (Germany),Lancaster University,PHI-STONE AG,AUREL SPA,UDL,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,UoN,WALTER PACK,Printed Electronics Ltd,BARNICES Y PINTURAS MODERNAS SOCIEDAD ANONIMA,IKS,GALVANI BIOELECTRONICS LIMITED,IMDEA NANO,TEMAS AG TECHNOLOGY AND MANAGEMENT SERVICES,Composites Evolution (United Kingdom),CAMBRIDGE RAMAN IMAGING LTD,UNIPD,UNITS,University of Regensburg,University of Bremen,UNISTRA,VRS,AIXTRON LIMITED,AMALYST,BEDIMENSIONAL SPA,Plastic Logic (United Kingdom),INSTITUTO NACIONAL DE INVESTIGACION Y TECNOLOGIA AGRARIA Y ALIMENTARIA OA MP,LHT,STMicroelectronics (Switzerland),Nanesa,TME,EGP,DALLARA AUTOMOBILI SPA,CIC nanoGUNE,UNIGE,ALCATEL ITALIA,CEA,M-Solv,BASF SE,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,MAGNA ELECTRONICS SWEDEN AB,ProGnomics Ltd.,TUD,Unisa,BRETON SPA,LITHOPS SRL,IMEC,BRUNO BALDASSARI & FRATELLI SPA,DTU,EPFL,DI,WUT,Sonaca (Belgium),IMech-BAS,Evonik Nutrition & Care GmbH,CRF,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,THALES,FNSR,Technion – Israel Institute of Technology,Varta Microbattery (Germany),DELTA TECH SPA,HMU,Bundeswehr University Munich,EVONIK DEGUSSA GmbH,INTERNACIONAL DE COMPOSITES SA,NOKIA UK LIMITED,OINT,HITACHI ENERGY SWEDEN AB,NOKIA SOLUTIONS AND NETWORKS UK LIMITED,University of Groningen,TU/e,TU Delft,CNR,IIT,CAU,Siemens (Germany),DIPC,ICN2,GRAPHENEA SEMICONDUCTOR SL,NanoTechLab,QMUL,LNE,UT,UNIBO,RWTH,NPL MANAGEMENT LIMITED,Chalmers University of Technology,Singulus (Germany),Emberion Ltd,ITME,ICFO,G TEC,EMBERION OY,GRAPHMATECH AB,TUHH,IDIBAPS,IAW,ESF,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,SCHAFFHAUSEN INSTITUTE OF TECHNOLOGY AG,POLYMEM,Umeå University,University of Sheffield,Robert Bosch (Germany),University of Freiburg,University of Rome Tor Vergata,BIOAGE,FSU,University of Manchester,FIDAMC,E. AMALDI FOUNDATION,GRUPO ANTOLIN-INGENIERIA SA,ICON LIFESAVER LIMITED,NAWATECHNOLOGIES,ABB AB,Chemnitz University of Technology,MPG,Polytechnic University of Milan,University of Ulm,FHG,Graphenea (Spain),GRAPHENE-XT SRL,NOVALIA LIMITED,EAB,Mellanox Technologies (Israel),ARCELORMITTAL,INDORAMA VENTURES FIBERS GERMANY GMBH,SIXONIA TECH,Infineon Technologies (Germany),LEONARDO,VMI,SPAC SPA,Technological Educational Institute of CreteFunder: European Commission Project Code: 785219Overall Budget: 88,000,000 EURFunder Contribution: 88,000,000 EURThis proposal describes the third stage of the EC-funded part of the Graphene Flagship. It builds upon the results achieved in the ramp-up phase (2013 - 2016) and the first core project (2016 - 2018), and covers the period April 2018 - March 2020. The progress of the flagship follows the general plans set out in the Framework Partnership Agreement, and the second core project represents an additional step towards higher technology and manufacturing readiness levels. The Flagship is built upon the concept of value chains, one of which is along the axis of materials-components-systems; the ramp-up phase placed substantial resources on the development of materials production technologies, the first core project moved to emphasise components, and the second core project will move further towards integrating components in larger systems. This evolution is manifested, e.g., in the introduction of six market-motivated spearhead projects during the Core 2 project.
more_vert Open Access Mandate for Publications assignment_turned_in Project2016 - 2018Partners:HEIDELBERG MATERIALS ITALIA CEMENTI SPA, UAB, UZH, INTER-QUIMICA, TUW +183 partnersHEIDELBERG MATERIALS ITALIA CEMENTI SPA,UAB,UZH,INTER-QUIMICA,TUW,CSIC,Alcatel-Lucent (Germany),University of Warwick,AALTO,BSU,TCD,UM,TUM,UNIBAS,SISSA,CRAYONANO AS,HUN-REN CENTRE FOR ENERGY RESEARCH,UCL,University of Groningen,UCLM,NOKIA R&D (UK) LTD,CIC ENERGIGUNE,TU/e,TU Delft,CNR,IIT,INSERM,NanOsc AB,AIRBUS OPERATIONS SL,CNIT,CHALMERS INDUSTRITEK,UniPi,ULB,ETHZ,FAU,KI,Horiba (France),CNRS,UOXF,Lancaster University,UDL,AVCR,MCS,UoN,EPCOS AG,Imperial,DSM Ahead,EMPA,INFN,AMO GMBH,TECNALIA,University of Regensburg,University of Bremen,IKS,Umeå University,UNIPD,AVANZARE,UNISTRA,UNITS,AIXTRON LIMITED,SES SPA,IMDEA NANO,AMALYST,Nokia (Finland),Plastic Logic (United Kingdom),INSTITUTO NACIONAL DE INVESTIGACION Y TECNOLOGIA AGRARIA Y ALIMENTARIA OA MP,LiU,Carlos III University of Madrid,Sorbonne University,STMicroelectronics (Switzerland),UMINHO,RF360 EUROPE GMBH,UCL,Nanesa,University of Zaragoza,CIC nanoGUNE,KIT,UCD,CIC biomaGUNE,BMVg,CIBER,NSN,DropSens S.L.,PIXIUM VISION,CNM TECHNOLOGIES GMBH,UNIGE,TUD,Bielefeld University,Unisa,Repsol (Spain),Universität Augsburg,University of Ioannina,FBK,BRETON SPA,LITHOPS SRL,AUREL SPA,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,WALTER PACK,Printed Electronics Ltd,GALVANI BIOELECTRONICS LIMITED,IMEC,BRUNO BALDASSARI & FRATELLI SPA,CAU,ICN2,GRAPHENEA SEMICONDUCTOR SL,University of Namur,ALCATEL ITALIA,UPMC,CEA,UOC,M-Solv,BASF SE,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,Atherm,ProGnomics Ltd.,University of Sheffield,NanoTechLab,Robert Bosch (Germany),University of Freiburg,DTU,EPFL,UH,POLITO,DI,WUT,Technion – Israel Institute of Technology,IMech-BAS,NVISION,J. Heyrovsky Institute of Physical Chemistry,GRINP,CRF,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,THALES,Bundeswehr University Munich,INTERNACIONAL DE COMPOSITES SA,NOKIA UK LIMITED,OINT,HITACHI ENERGY SWEDEN AB,NOKIA SOLUTIONS AND NETWORKS UK LIMITED,University of Rome Tor Vergata,GLAXOSMITHKLINE RESEARCH AND DEVELOPMENT LTD.,QMUL,LNE,UT,UNIBO,RWTH,NPL MANAGEMENT LIMITED,Chalmers University of Technology,LIBRE SOCIETA A RESPONSABILITA LIMITATA,Emberion Ltd,ITME,ICFO,G TEC,EMBERION OY,DELTA TECH SPA,TUHH,IDIBAPS,IAW,ESF,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,POLYMEM,FSU,UW,UEF,University of Manchester,FIDAMC,E. AMALDI FOUNDATION,USTL,GRUPO ANTOLIN-INGENIERIA SA,Chemnitz University of Technology,MPG,Polytechnic University of Milan,University of Ulm,FHG,Graphenea (Spain),GRAPHENE-XT SRL,NOVALIA LIMITED,EAB,G24 POWER LIMITED,SU,ARCELORMITTAL,STICHTING RADBOUD UNIVERSITEIT,INDORAMA VENTURES FIBERS GERMANY GMBH,Infineon Technologies (Germany),University of Sunderland,LEONARDO,VMI,Technological Educational Institute of CreteFunder: European Commission Project Code: 696656Overall Budget: 89,000,000 EURFunder Contribution: 89,000,000 EURThis project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CSA) under the 7th framework program (2013-2016), while this and the following parts are implemented as Core Projects under the Horizon 2020 framework. The mission of the Graphene Flagship is to take graphene and related layered materials from a state of raw potential to a point where they can revolutionise multiple industries. This will bring a new dimension to future technology – a faster, thinner, stronger, flexible, and broadband revolution. Our program will put Europe firmly at the heart of the process, with a manifold return on the EU investment, both in terms of technological innovation and economic growth. To realise this vision, we have brought together a larger European consortium with about 150 partners in 23 countries. The partners represent academia, research institutes and industries, which work closely together in 15 technical work packages and five supporting work packages covering the entire value chain from materials to components and systems. As time progresses, the centre of gravity of the Flagship moves towards applications, which is reflected in the increasing importance of the higher - system - levels of the value chain. In this first core project the main focus is on components and initial system level tasks. The first core project is divided into 4 divisions, which in turn comprise 3 to 5 work packages on related topics. A fifth, external division acts as a link to the parts of the Flagship that are funded by the member states and associated countries, or by other funding sources. This creates a collaborative framework for the entire Flagship.
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