FleFlex2Energy is a 48-month project with the ambitious goal to manufacture reliable Integrated Photovoltaics (IPVs) with differentiated product design, through the development of the first-of-each-kind Automated Roll-to-Roll (R2R) Manufacturing Line for Organic PVs. The F2E Manufacturing Line consists of the R2R Printing & Automated Assembly Machines, enhanced with robust metrologies for inline quality & process control under Artificial Intelligence (AI) analysis, implementing industry 4.0 concept. F2E IPVs will comply with all the standards, codes and product requirements of use in Buildings, Agriculture and Automotive sectors. The novel idea of Flex2Energy will be realized by 5 objectives: • Develop and upgrade manufacturing tools for design and aesthetics of OPV products, inline process quality control techniques and easily adaptable equipment design for printed PV technologies • Integrate tools, QC, equipment to Machines to build & demonstrate automated PL manufacturing of IPVs • Manufacturing high efficiency, durable printed IPV products at competitive cost • Demonstrate and Validate IPVs in energy efficient buildings, automotive and agriculture industries with minimum environmental and landscape impact • Deploy Market Strategy and Bridge the gap between PV and Building sectors F2E will implement innovative IPV products in three dedicated business cases to promote their early adoption and boost the new market demands. BIPV products will be installed on a public and a heavy industry building façade as energy efficient windows, while Agri-PVs will be installed on the roof of a Med GH working as a shade curtain system for growth of tomatoes and as energy generator making the GH energy autonomous. Finally, VIPVs will be installed on the roof of a commercial EV to increase mileage and also on the roof of a solar Carport to provide energy to electric vehicles. The IPV products will be evaluated in terms of performance, durability, social and industrial acceptance.

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The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM will be a path-finding project which supports and complements several existing and future ECSEL pilot-line projects and is linked to the MASP area 7.1 (subsection More Moore). Innovative demonstrators and methodologies will be built and evaluated within the themes of metrology and characterization of 3D device architectures and new materials, across the full IC manufacturing cycle from Front to Back-End-Of-Line. 3D structural metrology and defect analysis techniques will be developed and correlated to address challenges around 3D CD, strain and crystal defects at the nm scale. 3D compositional analysis and electrical properties will be investigated with special attention to interfaces, alloys and 2D materials. The project will develop new workflows combining different technologies for more reliable and faster results; fit for use in future semiconductor processes. The consortium includes major European semiconductor equipment companies in the area of metrology and characterization. The link to future needs of the industry, as well as critical evaluation of concepts and demonstrators, is ensured by the participation of IMEC and LETI. The project will directly increase the competitiveness of the strong Europe-based semiconductor Equipment industry. Closely connected European IC manufacturers will benefit by accelerated R&D and process ramp-up. The project will generate technologies essential for future semiconductor processes and for the applications enabled by the new technology nodes.