TRISTAN’S overarching aim is to expand, mature and industrialize the European RISC-V ecosystem so that it is able to compete with existing commercial alternatives. This will be achieved by leveraging the Open-Source community to gain in productivity and quality. This goal will be achieved by defining a European strategy for RISC-V based designs including the creation of a repository of industrial quality building blocks to be used for SoC designs in different application domains (e.g. automotive, industrial, etc.). The TRISTAN approach is holistic, covering both electronic design automation tools (EDA) and the full software stack. The broad consortium will expose a large number of engineers to RISC-V technology, which will further encourage adoption. This ecosystem will ensure a European sovereign alternative to existing industrial players. The 3-year project fits in the strategy of the European Commission to support the digital transformation of all economic and societal sectors, and speed up the transition towards a green, climate neutral and digital Europe. This transformation includes the development of new semiconductor components, such as processors, as these are considered of key importance in retaining technological and digital sovereignty and build on significant prior investments in knowledge generation in this domain. Development strategies leveraging public research funding that exploit Open-Source have been shown to boost productivity, increase security, increase transparency, allow better interoperability, reduce cost to companies and consumers, and avoid vendor lock-ins. The TRISTAN consortium is composed of 46 partners from industry (both large industries as well as SMEs), research organizations, universities and RISC-V related industry associations, originating from Austria, Belgium, Finland, France, Germany, Israel, Italy, the Netherlands, Poland, Romania, Turkey and Switzerland.

The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enhancements in many industries across the electronic components and system (ECS) value chain and have to be an integral part of any Cyber Physical Systems (CPS) which consist of metrology equipment, virtual metrology or Industrial internet of things (IIoT) sensors, edge and high-performance computing (HPC). The requirements from the metrology is to support ALL process steps toward the final product. However, for any given ECS technology, there is a significant trade-off between the metrology sensitivity, precision and accuracy to its productivity. MADEin4 address this deficiency by focusing on two productivity boosters which are independent from the sensitivity, precision and accuracy requirements: • Productivity booster 1: High throughput, next generation metrology and inspection tools development for the nanoelectronics industry (all nodes down to 5nm). This booster will be developed by the metrology equipment’s manufacturers and demonstrated in an industry 4.0 pilot line at imec and address the ECS equipment, materials and manufacturing major challenges (MASP Chapter 15, major challenges 1 – 3). • Productivity booster 2: CPS development which combines Machine Learning (ML) of design (EDA) and metrology data for predictive diagnostics of the process and tools performances predictive diagnostics of the process and tools performances (predictive yield and tools performance). This booster will be developed and demonstrated in an industry 4.0 pilot line at imec, for the 5nm node, by the EDA, computing and metrology partners (MASP Chapter 15, major challenge 4). The same CPS concept will be demonstrated for the ‘digital industries’ two major challenges of the nanoelectronics (all nodes down to 5nm) and automotive end user’s partners (MASP Chapter 9, major challenges 1and 3).

Electrification and autonomy drive the rapid evolution of modern vehicles, requiring increasing computational capabilities, coupled with safety and efficiency. The classical, decentralized multi- Electronic Control Units (ECU) architecture has significant drawbacks when it comes to scalability, and it is becoming untenable. The dominant megatrend pushes for an increasing number of key functionalities to be software-defined, with the direct implication that the software content (lines-of-code) in a vehicle will grow by 10x in just 5 years, to 1 billion by 2030. From a hardware viewpoint, increased complexity and autonomy requires a more centralized approach to on-board computing to curtail cost, latency and bandwidth bottlenecks of the in-vehicle network. Centralizing the E/E architecture requires merging multiple Electronic Control Units (ECUs) into powerful, fully programmable Domain Control Units (DCUs) or Zonal Control Units (ZCUs). To address this paradigm shift, the Rigoletto project will establish the foundation for a next-generation Automotive Hardware Platform based on the open RISC-V instruction set architecture (ISA), bolstering and securing Europe's leading role in the automotive electronics industry. The project aligns with the high-level goal of EU Chips Joint Undertaking and the of the industry-led Vehicle of the Future initiative: namely, the creation of a RISC-V based automotive hardware platform strongly linked with the formation of an open, software-defined vehicle ecosystem led by European automotive manufacturers and suppliers. Rigoletto aims at developing RISC-V intellectual property (IP) components, including processor cores, accelerators, interconnects, memory hierarchy and peripheral subsystems. A wide range of performance profiles will be targeted for next-generation DCUs and ZCUs, to enable increasingly electrified, automated, and connected vehicles.

The challenges and major HiCONNECTS objectives are to transform the centralized cloud platform to decentralized platforms which include edge cloud computing in a sustainable, energy-efficient way. This will bring cloud services including Artificial Intelligence (AI) closer to the IOT end-users, which enables them to really use the COT and IOT efficiently. The technologies underpinning this revolutionary step include the development of high-performance computing, storage infrastructure, network interfaces and connecting media , and the analysis of IOT sensors and big data in real-time. This major step forward will enable, for example, the mobile clients (during the 5G deployment phase and 6G exploration) to move among different places with minimum cost, short response time and with stable connection between cloud nodes and mobile devices. The main underlying technology to be developed by the HiCONNECTS consortium, comprising large industrial players, universities and RTO’s, and many SMEs, can be summarized under the title: ’heterogenous integration’ (HI) which is needed to meet the computing power, bandwidth, latency and sensing requirements for the next generation cloud and edge computing and applications. The HI revolution brings the electronic components and systems (ECS) into a new domain, which combines traditional silicon wafers integrated circuit (IC), InP based high speed electronics , and Si and InP photonics devices and interconnect. The HiCONNECTS ambition is to demonstrate, through HI development, a leap in computing and networking reliability and performances across the full vertical and horizontal ECS value chain (i.e. essential capabilities and key applications) in a sustainable way. In addition, HiCONNECTS will focus on the development of next generation design, algorithms, equipment (HW/SW), systems and Systems of Systems (SOS).

The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. Its consortium covers the entire value chain for manufacturing of the CMOS chips in the 10A node, that is, from chip design to lithography to process technology and finally chip metrology. Essential parts of hardware, software and processing technology are developed pushing the boundaries of semiconductor design and manufacture to enable the new node and keep Moore’s law alive. The 10ÅCe project is built based on the following four pillars. Lithography Equipment: ASML and expert EUV partners Zeiss, FastMicro, IOM, Plasma Matters, TNO, TU/e, University of Twente and VDL-ETG will: • Increase key performance indicators of the EUV tool, to enable smaller pitches and increase yield. • Increase sustainability of the EUV tool, both during production as well as increasing the times a module in an EUV tool can be refurbished. Chip design and mask optimization: Imec with the involvement of expert imaging , CAD and IP design partners ARM, ASML and Siemens will: • Assess the impact of the introduction of 3D mCFET on chip design: in terms of power, performance and area. • Development of new computational lithography solutions to print 10Å CFET structures, to improve imaging by next generation mask design. Process Technology: As the ultimate device for logic, the CFET architecture is proposed and Imec and expert partners Coventor, EVG, IBS, Intel, JSR, LAM, RECIF, TEL, Zeiss and Wooptix will: • Demonstrate a fully functional monolithic CFET (mCFET) • Increase sustainability of the chip manufacturing process, across the manufacturing process and including resist material development. Process characterization: Applied Materials and expert partners Thermofisher, Nova, KLA and Bruker will: • Explore and realize high throughput and sample density per wafer, for the analysis, characterization for 10Å 3D CFET devices, interconnect and materials