The security constitutes a crucial component of Media and Communication technologies. It represents, without any doubt, one of the levers of its rise because it is at the base of the introduction of confidence necessary for the end users. Among the threats which weigh more on the security, the vulnerability of the electronic material which implements cryptography in particular to return the services necessary of confidentiality, identification and authentification is perhaps most important. Indeed, certain fraudulent handling or attacks on this hardware makes it possible to extract from the confidential information like the keys of encryption and thus to put at evil all the protected transmission chain of information. The track race engaged between the designers of circuits and the badly disposed people accelerates with the diversity of the systems, their opening and their multiplicity. A major stake in the security of the communication systems is to improve resistance of the components to these attacks. If the development scheme, based on a very pragmatic approach of the problem, set up for the first products establishing of the functions of security were an acceptable time, it is not it today any more. Among the most known attacks, those called by "side channels" (or observation), exploit the correlation between the handled data and the consumption or the electromagnetic radiation of the component. Another type of attacks, called by "injection of faults" circumvents protections intended to protect the sensitive informations, while modifying, for example by illumination or glitching the supply voltage, the operation of the component. A third type of attacks, more difficult to implement, consists in analyzing the design of the chip using invasive processes (abrasion, chemical engraving, laser, SEM, etc) then to probe the signals carrying secret information. It thus seems today a major stake in the security of the communication systems, to improve hardness of the components to these attacks. This stake is even more important for embedded technologies. Indeed, once this type of product on the ground, its cycle of "survival" is responsibility for the seller. He must be able to estimate, by advance, the potential resistance of its systems to the vulnerabilities of tomorrow. The degree of robustness of a circuit is thus, more than ever, a parameter determining for the manufacturers of circuits, it is one to put forward to them and an important witness of their competitiveness. If the electromagnetic susceptibility of the circuits is largely studied by CEM community, no work is dedicated to the exploitation of this one intentionally to generate faults within the protected circuits and to carry out differential analyses of faults (DFA). The field of investigation “electromagnetic emissions and security” thus seems virgin. Moreover, in order to reduce consumption and to make possible the thinning thicknesses of oxide, the decrease in the supply voltages led to a higher vulnerability of the components. With each technological jump, the components become sensitive to increasingly fast transitory signals for given amplitude. The objective of the EMAISeCi project is to allow a theoretical comprehension of the influence of EM (for the observation or the injection of faults) on integrated circuits; in that, it is distinguished clearly from the work devoted to the study of the electromagnetic compatibility of electronic devices. This comprehension will later on make it possible to build counter measures dedicated to the emergent threats on security based on the exploitation of the EM channel. This research project is a fundamental one. It will make it possible to confront the scientific assumptions put forth with the experimental results obtained thanks to the developments of advanced security characterization benches.

The QLSI2 FPA proposal consists of 23 partners from 9 different countries, with one of the partners under associated country ownership. By integrating the QLSI2 consortium into the global European quantum ecosystem of complementary European and national consortia, a strong synergistic European partnership will be established with the ambition to demonstrate a cloud-accessible full-stack quantum computer with at least 1000 semiconductor-based qubits by 2029. The QLSI2 partners will leverage the expertise of key European players (RTOs, academic laboratories, start-ups and large companies) in complementary fields of quantum technologies, from hardware to software, to define and implement a roadmap towards such an ambitious goal. The roadmap will extend its vision to the entire value chain, including the supply chain. Particular attention will be paid to the industrialisability of the proposed solution in order to keep Europe at the forefront of the race for quantum supremacy for a long time to come. The roadmap will be implemented in the Specific Grant Agreements (SGA) that will be awarded under the FPA upon its successful completion. In addition to demonstrating large-scale semiconductor-based quantum computers, these SGA will aim to advance both technology and manufacturing readiness to a level high enough to meet Europe's ambitions for its quantum computing capability.

"The ""AfriConnect+"" project, under priority Europe fit for a digital age, is part of the modernization and development strategy of the southern countries concerned, Senegal and Morocco, which share common objectives regarding the development of entrepreneurship, professional skills, innovation and technology transfer in the digital field and more particularly in the Internet of Things (IoT).In China, the United States and Europe, this technology is currently undergoing a major transformation and is an integral part of the digital transformation, with significant economic and employment stakes.In order to avoid a dropout in this strategic field in Africa, ""AfriConnect+"" will promote the transfer of knowledge and technical support between European and African institutions around 4 specific objectives: The transfer of IoT skills; The identification and development of applications to create startups; The support to entrepreneurship; The strengthening of links between universities, secondary schools and industry. The expected results in the 4 beneficiary universities are the realization of more than 72 training modules followed by a total of 1000 learners (trainers, professionals, researchers or entrepreneurs), more than 300 students involved in innovative IoT projects, 36 student internships, 24 entrepreneurs trained to create a company with at least 12 startups launched.These actions will be developed in adapted structures that each southern partner will need to create and share. Thus, a network of 4 ""IdO Labs"" (laboratory for the design of connected objects) and at least as many platforms for experimentation in a priority field of applications such as agriculture, renewable energy or intelligent buildings, will have to support this project. AfriConnect+: enpowering people through education and skills in the digital area!"

The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors. We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market. The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe. The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition. SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas: i) Advanced features: prepare next generation of FDSOI technologies and components; ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing; iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar). The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology. SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.

In view of the importance of core technologies both for European sovereignty and for decreasing the dependence of European industry on American and Asian technologies in the smart networks and services domains, it is vital that Europe reinvents its strategy for developing core technologies for 5G and beyond. This requires concrete and coordinated actions from both the European telecommunications industry and the European microelectronics industry. COREnect brings together the most prominent European industrial and academia players as well as industry associations in the network, microelectronics and verticals domains to jointly design a core technology roadmap. The goal is to establish a sustainable European technology sovereignty in 5G and beyond, promote innovation and business opportunities e.g. for small and medium-sized businesses (SMEs), pave the way for one or more future European champions in this area, and lay a solid foundation for the long-term success of both industries. A new COREnect community will emerge from the close collaboration between Smart Networks and Services (SNS) and Key Digital Technologies (KDT) communities as well as with other related communities, e.g., on High-Performance Computing (HPC), artificial intelligence (AI), Photonics, IoT and Cloud. Through outreach activities via its extensive industry and academia network, COREnect will have the potential to significantly impact the European R&I and industry landscape of future connectivity systems over the next ten years.